xe056lcc Xecom, Inc, xe056lcc Datasheet - Page 6

• Manufacturer Part Number: xe056lcc
• Description: Surface-mount Slim-link Daa For 56k Bps Data Transfer
• Manufacturer: Xecom, Inc

Because of its Hybrid construction, the XE056LCC DAA is subject to damage if over exposed to heat
during solder reflow operations. Following the soldering instructions below will ensure that the process
of soldering the module to the board does not damage the DAA.
Notes:
Do not expose the XE056LCC DAA module to direct Infrared (IR) heating. If your process includes
direct IR heating, you must shield the DAA module from the infrared radiation.
Xecom’s XE056LCC DAA modules should be exposed to no more than one reflow cycle.
Slim-Link
220
180
150
XECOM
O
O
O
C
C
C
------------------------------180 sec max-------------------------
®
Maximum Time above Eutectic (180
Maximum Recommended Solder Temperature Profile
PLCC Soldering Instructions
Maximum Preheat Dwell Time
Maximum Time at 220
Maximum Temperature
(6)
O
O
C)
C
20 Seconds
90 Seconds
220
180 Seconds
O
C
----- 90 sec max -----
-20 sec-
max
XE056LCC