rsc-464 ETC-unknow, rsc-464 Datasheet - Page 38

• Manufacturer Part Number: rsc-464
• Description: Speech Recognition Processor
• Manufacturer: ETC-unknow

RSC-464
RSC-464 Die Bonding Pad Locations
Notes:
1. Coordinates are in microns (um), rounded to nearest um.
2. Coordinates are of the center of the bonding pad opening (70um).
3. Coordinate (0,0) is the lower left corner of the die.
4. Die size with scribe and seal ring is 2805 um x 3415 um.
5. No external die substrate tie is required. However, a substrate tie to ground is preferred.
38
PAD #
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
1
2
3
4
5
6
7
8
9
PADNAME X (um) Y (um)
AMPCOM
DACOUT
reserved
MICIN2
MICIN1
AVDD
VREF
GND
GND
GND
GND
VCM
PDN
VDD
VDD
P2.7
P2.6
P2.5
P2.4
VDD
VDD
P2.3
P2.2
P2.1
P2.0
XO2
XO1
XI2
XI1
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
55
3330
3228
3127
3032
2930
2828
2726
2624
2523
2428
2326
2224
2122
2020
1918
1817
1715
1613
1511
1409
1307
1206
811
709
607
505
403
302
200
PAD #
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
P/N 80-0282-A
PADNAME X (um) Y (um)
-RESET
PLLEN
PWM0
PWM1
AVSS
P0.7
P0.6
P0.5
P0.4
VDD
VDD
GND
GND
P0.3
P0.2
P0.1
P0.0
VDD
VDD
GND
GND
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
2750
55
1097
1197
1297
1397
1830
2265
2365
2465
2565
2997
196
296
396
497
597
697
797
897
997
98
96
Preliminary Data Sheet
© 2005 Sensory Inc.