tga2513-epu TriQuint Semiconductor, tga2513-epu Datasheet - Page 8

• Manufacturer Part Number: tga2513-epu
• Description: Wideband Lna With Agc
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
1.351 (0.053)
1.242 (0.049)
0.235 (0.009)
0.000 (0.000)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
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Units: millimeters (inches)
Thickness: 0.100 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond Pad #1:
Bond Pad #2:
Bond Pad #3:
Bond Pad #4:
Bond Pad #5:
Mechanical Characteristics
RF IN
VG2
VD
RF OUT
VG1
0.100 x 0.125 (0.004 x 0.005)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.125 (0.004 x 0.005)
0.100 x 0.100 (0.004 x 0.004)
0.100 x 0.125 (0.004 x 0.005)
Advance Product Information
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September 2, 2005
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5
TGA2513-EPU
1.210 (0.048)
0.973 (0.038)
0.099 (0.004)
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