ipb017n06n3 Infineon Technologies Corporation, ipb017n06n3 Datasheet

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ipb017n06n3

Manufacturer Part Number
ipb017n06n3
Description
Optimos Tm 3 Power Transistor Power Mosfet
Manufacturer
Infineon Technologies Corporation
Datasheet

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ipb017n06n3 G
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Part Number:
ipb017n06n3G
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Rev. 2.0
1)
2)
3)
4)
Type
Features
• Ideal for high frequency switching and sync. rec.
• Optimized technology for DC/DC converters
• Excellent gate charge x R
• Very low on-resistance R
• N-channel, normal level
• 100% avalanche tested
• Pb-free plating; RoHS compliant
• Qualified according to JEDEC
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
OptiMOS
Type
Package
Marking
J-STD20 and JESD22
Current is limited by bondwire; with an R
See figure 3 for more detailed information
See figure 13 for more detailed information
(TM)
3 Power-Transistor
IPB017N06N3 G
PG-TO263-7
017N06N
3)
j
=25 °C, unless otherwise specified
DS(on)
DS(on)
1)
4)
product (FOM)
for target applications
thJC
Symbol Conditions
I
I
E
V
P
T
D
D,pulse
j
AS
GS
tot
=0.6 K/W the chip is able to carry 284 A.
, T
stg
T
T
T
I
T
D
page 1
C
C
C
C
=100 A, R
=25 °C
=100 °C
=25 °C
=25 °C
2)
GS
=25
Product Summary
V
R
I
D
DS
DS(on),max
-55 ... 175
55/175/56
Value
180
180
720
634
±20
250
IPB017N06N3 G
180
1.7
60
Unit
A
mJ
V
W
°C
V
m
A
2008-12-11

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ipb017n06n3 Summary of contents

Page 1

... =25 °C D,pulse =100 =25 °C tot stg =0.6 K/W the chip is able to carry 284 A. thJC page 1 IPB017N06N3 1.7 m 180 A Value Unit 180 A 180 720 634 mJ ±20 V 250 W -55 ... 175 °C 55/175/56 2008-12-11 ...

Page 2

... GSS = =100 A DS(on |>2 DS(on)max =100 (one layer, 70 µm thick) copper area for drain page 2 IPB017N06N3 G Values Unit min. typ. max 0.6 K 0.1 3 µ 300 - 1 100 ...

Page 3

... oss =25 ° S,pulse =100 =25 ° = =100A /dt =100 A/µ page 3 IPB017N06N3 G Values Unit min. typ. max. - 17000 23000 pF - 3700 4900 - 120 - - ...

Page 4

... C 4 Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µs 100 µ [V] DS page 4 IPB017N06N3 G ≥ 100 150 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 200 ...

Page 5

... DS 8 Typ. forward transconductance g =f 320 280 240 200 160 120 175 °C 25 ° [V] GS page 5 IPB017N06N3 =25 ° 4 160 240 320 I [A] D =25 ° 160 I [ 400 ...

Page 6

... Forward characteristics of reverse diode I =f parameter Ciss [V] DS page 6 IPB017N06N3 1960 µA 196 µA - 100 140 T [° 175 °C 25 °C 175 °C, max 25 °C, max 0.5 1 1.5 V [V] SD ...

Page 7

... AV 16 Gate charge waveforms s(th) Q g(th) 60 100 140 180 [°C] j page 7 IPB017N06N3 =100 A pulsed gate 120 160 200 Q [nC] gate 240 ...

Page 8

... PG-TO263-7 (D²-Pak 7pin) Rev. 2.0 page 8 IPB017N06N3 G 2008-12-11 ...

Page 9

... Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 9 IPB017N06N3 G 2008-12-11 ...

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