ml12016 Lansdale Semiconductor, Inc., ml12016 Datasheet - Page 4

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ml12016

Manufacturer Part Number
ml12016
Description
Dual Modulus Prescaler
Manufacturer
Lansdale Semiconductor, Inc.
Datasheet
ML12015, ML12016, ML12017
Page 4 of 4
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
C
A
A1
B
E
8
1
e
D
0.25
B
M
5
4
C B
H
S
A
A
0.25
S
SEATING
PLANE
(ML12015PP, ML12016PP, ML12017PP)
M
(ML12015-5P, ML12016-5P, ML12017-5P)
0.10
B
OUTLINE DIMENSIONS
M
h
PLASTIC PACKAGE
www.lansdale.com
PLASTIC P
X 45°
CASE 626-04
P DIP 8 = PP
CASE 751-06
SO 8 = -5P
ISSUE T
(SO–8)
ACKAGE
C
L
NOTES:
1. DIMENSIONING AND T OLERANCING PER ASME
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOW ABLE DAMBAR
PROTRUSION SHALL BE 0.127 T OTAL IN EXCESS
OF THE B DIMENSION A T MAXIMUM MATERIAL
CONDITION.
DIM
A1
A
B
C
D
E
H
h
θ
L
e
MILLIMETERS
MIN
0.25
1.35
0.10
0.35
0.19
4.80
3.80
5.80
0.40
1.27 BSC
LANSDALE Semiconductor, Inc.
MAX
0.50
1.75
0.25
0.49
0.25
5.00
4.00
6.20
1.25
Issue A

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