cp324 Central Semiconductor Corp., cp324 Datasheet
cp324
Manufacturer Part Number
cp324
Description
Small Signal Mosfet Transistor N- Channel Enhancement-mode Transistor Chip
Manufacturer
Central Semiconductor Corp.
Datasheet
1.CP324.pdf
(2 pages)
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
Central
Semiconductor Corp.
GEOMETRY
PROCESS DETAILS
Top Side Metalization
Process
Die Size
Die Thickness
Gate Bonding Pad Area
Source Bonding Pad Area
Back Side Metalization
BACKSIDE DRAIN
TM
N - Channel Enhancement-Mode Transistor Chip
Small Signal MOSFET Transistor
21.65 x 21.65 MILS
9.0 MILS
5.5 x 5.5 MILS
5.9 x 13.8 MILS
Al - 30,000Å
Au - 12,000Å
EPITAXIAL PLANAR
GROSS DIE PER 5 INCH WAFER
PRINCIPAL DEVICE TYPES
PROCESS
2N7002
35,900
R2 (18-August 2006)
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cp324 Summary of contents
Page 1
Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY BACKSIDE DRAIN 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) ...
Page 2
Central TM Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS Typical Electrical Characteristics R2 (18-August 2006) ...