hcts283ms Intersil Corporation, hcts283ms Datasheet - Page 9

• Manufacturer Part Number: hcts283ms
• Description: Radiation Hardened 4 Bit Binary Full Adder With Fast Carry
• Manufacturer: Intersil Corporation

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY: <2.0 x 10
BOND PAD SIZE:
Metallization Mask Layout
78 x 86 mils
2.21mm x 2.19mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
100 m x 100 m
4 x 4 mils
B1 (2)
A1 (3)
A0 (5)
B0 (6)
S0 (4)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
2
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Å
For information regarding Intersil Corporation and its products, see www.intersil.com
2.6k
Å
Å
1k
Å
S1
(1)
5
CIN
(7)
A/cm
HCTS283MS
2
HCTS283MS
9
GND
VCC
(8)
(16)
(15)
B2
COUT
(9)
(14)
A2
(10)
S3
Spec Number
(13) S2
(12) A3
(11) B3
518641