hcts138ms Intersil Corporation, hcts138ms Datasheet - Page 9

• Manufacturer Part Number: hcts138ms
• Description: Rad-hard Inverting 3-to-8 Line Decoder/demultiplexer
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
85 x 101 mils
Type: SiAl
Metal Thickness: 11k
mask series for the HCTS138 is TA14461A.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
A2 (3)
E1 (4)
E2 (5)
E3 (6)
NC
NC
For information regarding Intersil Corporation and its products, see www.intersil.com
Å
± 1k
Å
9
(7)
Y7
A1
(2)
GND
(8)
HCTS138MS
A0
(1)
HCTS138MS
VCC
(16)
(9)
Y6
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Type: SiO
Thickness: 13k
<2.0 x 10
100µm x 100µm
4 x 4 mils
(15)
Y0
5
(10)
2
Y5
A/cm
Å
2
± 2.6k
Å
(14) Y1
NC
(13) Y2
(12) Y3
(11) Y4
NC
September 12, 2005
FN2462.3