ta7371afg TOSHIBA Semiconductor CORPORATION, ta7371afg Datasheet

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ta7371afg

Manufacturer Part Number
ta7371afg
Description
Fm Front?end
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
FM Front−End (1.5V USE)
The TA7371AFG is an FM front end IC designed for low voltage
operation (1.5V), which is suitable for stereo headphone radio or
radio cassette.
This IC contains RF amplifier, MIX, local oscillator and varactor
diode for AFC.
It simplifies the design of front end circuit.
Features
Block Diagram
Clamping diode for mixer output.
Varactor diode for AFC.
Local OSC. stop voltage: V
Low quiescent current
Low noise.
Very few external parts.
Operating supply voltage range.: V
I
CC
= 1.8mA (typ.) (V
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
CC
CC
= 1.5V, Ta = 25°C)
= 0.85V (typ.)
CC
TA7371AFG
= 0.95~5V (Ta = 25°C)
1
Weight: 0.08g (typ.)
TA7371AFG
2006-04-28

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ta7371afg Summary of contents

Page 1

... TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic FM Front−End (1.5V USE) The TA7371AFG front end IC designed for low voltage operation (1.5V), which is suitable for stereo headphone radio or radio cassette. This IC contains RF amplifier, MIX, local oscillator and varactor diode for AFC. It simplifies the design of front end circuit. ...

Page 2

... MIX block The MIX block is composed of the emitter coupled pair amplifier. (Fig.2) (3) OSC block OSC block is composed of the colpitts oscillation circuit. The capacitors C and C are built in this IC (Fig.1) (Fig.2) (Fig.3) 2 TA7371AFG 2006-04-28 ...

Page 3

... Ta = 25°C) CC Terminal Voltage Typ. (V) 0.7 0 ― ― 1.5 1.5 1.5 1.5 3 TA7371AFG = 1kHz) m Min. Typ. Max. Unit ― 1.8 2.6 mA ― dBµV EMF ― 12 ― dBµV EMF ― 25 ― 110 150 mV rms ― 0.85 ...

Page 4

... Test Circuit 1 Test Circuit 2 ● Conversion gain (dB ℓ TA7371AFG 2006-04-28 ...

Page 5

... Bobbin with ferrite core T φ 0.5mm UEW (external 24pF Bobbin with ferrite core T φ 0.5mm UEW (external) 4 SUMIDA ELECTRIC Co. LTD. 75pF 0133 − 309 − 048 SUMIDA ELECTRIC Co. LTD. 47pF 44M − 037 − 933A BPW B6A SFE 10.7 MA5 5 TA7371AFG 2006-04-28 ...

Page 6

... TA7371AFG 2006-04-28 ...

Page 7

... Package Dimensions Weight: 0.08g (typ.) 7 TA7371AFG 2006-04-28 ...

Page 8

... In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks. 8 TA7371AFG 2006-04-28 ...

Page 9

... R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath · solder bath temperature = 245°C · dipping time = 5 seconds · the number of times = once · use of R-type flux 021023_D 021023_B 060106_Q 9 TA7371AFG 060116EBA 021023_E 2006-04-28 ...

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