srf55v02s Infineon Technologies Corporation, srf55v02s Datasheet - Page 4

• Manufacturer Part Number: srf55v02s
• Description: Security & Chip Card Ics My-d Vicinity
• Manufacturer: Infineon Technologies Corporation

Document References
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Development Tool Overview
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1
Table 1
1)
Short Product Information
Type
SRF 55V02S C
SRF 55V02S MCC8 P-MCC8-2-1
SRF 55V02S Y1.0
SRF 55V02S Y2.0
plastic cards
Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in
Confidential Data Sheet
Qualification report chip
Chip delivery specification for wafer with chip-layout (die size, orientation, …)
Module specification containing description of package, product logistic etc.
Qualification report module
Inlay specification containing description of package, product logistic etc.
Qualification report inlay
my-d vicinity evaluation and demonstration kit
Ordering and Packaging information
Ordering Information
Package
Die
Inlay 45 x 45 mm
Inlay 45 x 76 mm
1)
2
2
256 bytes
User
4 / 10
Memory
64 bytes
Admin.
Pages
32
Ordering Code
Q67100H4895
on request
Q67100H4910
Q67100H4911
my-d vicinity
SRF 55V02S
2002-07-30