s72ns02gsf0yhmg9 Meet Spansion Inc., s72ns02gsf0yhmg9 Datasheet - Page 8

• Manufacturer Part Number: s72ns02gsf0yhmg9
• Description: S72ns-s Mirrorbit Eclipse? Flash Memory And Dram 2 Gb 128m X 16 Bit , 1.8 Volt-only, Multiplexed Simultaneous Read/ Write, Burst Mode Flash Memory 512 Mb 32m X 16 Bit Ddr Dram On Split Bus
• Manufacturer: Meet Spansion Inc.

5.
8
S72NS
Ordering Information
02G
The order number (Valid Combination) is formed by the following:
Notes
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm
S
availability of specific valid combinations and to check on newly released combinations.
Product
Family
S72NS
F0
YH
Density (Mb)
Code Flash
02G
M
D a t a
G
Technology
Process
9
S
S h e e t
S72NS-S Based MCPs
3
PACKING TYPE
0 = Tray
3 = 13-inch Tape and Reel
FLASH and DDR SPEED
9 = 104 MHz Flash, 166 MHz DDR DRAM
DDR Supplier
G = DRAM Type 5, x16 DDR
PACKAGE MODIFIER
M = 186-ball, 11x13mm, FBGA MCP
PACKAGE AND MATERIAL TYPE
YH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP (0.65 mm pitch, 1.2 mm
height)
DDR DRAM AND DATA FLASH DENSITY
F0 = 512 Mb DDR, No Data Flash
PROCESS TECHNOLOGY
S = 65 nm, MirrorBit
CODE FLASH DENSITY
02G = 2 Gb
PRODUCT FAMILY
S72NS Multi-Chip Product (MCP)
1.8 V Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus
DDR Density
(Mb)
( A d v a n c e
Valid Combinations
F0
Package Type/
®
Eclipse
Material
YHM
™
I n f o r m a t i o n )
Technology
DDR Vendor
G
S72NS-S_00_02 January 9, 2009
Flash & DDR
Speed
9
Packing Type
0, 3
(Note 1)