s72ns512pe0kjflg Meet Spansion Inc., s72ns512pe0kjflg Datasheet - Page 10
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s72ns512pe0kjflg
Manufacturer Part Number
s72ns512pe0kjflg
Description
Mirrorbit Flash Memory And Dram
Manufacturer
Meet Spansion Inc.
Datasheet
1.S72NS512PE0KJFLG.pdf
(14 pages)
6.
6.1
8
Physical Dimensions
NLC133—133-ball Fine-Pitch Ball Grid Array (FBGA) 11.0 x 10.0 mm
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
D1
Øb
eD
A1
A2
E1
eE
A
D
E
n
0.90
0.20
0.70
10.9
0.25
MIN
9.9
D5-D11, E4-E11, F4-F11
G4-G11, H4-H11, J4-J11
11.0 mm x 10.00 mm
K4-K11, L4-L11
PACKAGE
6.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLC 133
NOM
1.00
0.25
0.76
11.0
10.0
0.30
N/A
133
14
14
D a t a
MAX
1.10
0.30
0.82
11.1
10.1
0.35
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S72NS-P Based MCPs/PoPs
S h e e t
NOTE
( A d v a n c e
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
I n f o r m a t i o n )
S72NS-P_00_01 September 6, 2006
3436 \ 16-039.22 \ 12.09.04