maapgm0019-die Tyco Electronics, maapgm0019-die Datasheet - Page 6

• Manufacturer Part Number: maapgm0019-die
• Description: 1.6w X/ku-band Power Amplifier 9.5-13.0 Ghz
• Manufacturer: Tyco Electronics

Specifications subject to change without notice.
Customer Service: Tel. [phone]
Email: [e-mail]
1.6W X/Ku-Band Power Amplifier
North America: Tel. [phone]
Europe: Tel. [phone], Fax[phone]
Asia/Pacific: Tel.[phone], Fax [phone]
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
damage to amplifier.
V
GG
Figure 6. Recommended operational configuration. Wire bond as shown.
50 Ω
0.1 µF
RF
IN
VGG
VGG
100 pF
100 pF
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GG
VDD
VDD
12
12
100 pF
before applying positive bias to V
qxc
100 pF
VDD
VDD
3
3
100 pF
100 pF
RF
OUT
MAAPGM0019-DIE
RO-P-DS-3038 - -
0.1 µF
DD
to prevent
V
DD
V 1.00