maap-000077-smb001 M/A-COM, maap-000077-smb001 Datasheet - Page 6

• Manufacturer Part Number: maap-000077-smb001
• Description: Amplifier, Power, 0.7-2.5
• Manufacturer: M/A-COM

6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Amplifier, Power, 13W
0.7-2.5 GHz
Mechanical Information
Bond Pad Dimensions
DC Drain Supply Voltage VD1
DC Drain Supply Voltage VD2
DC Gate Supply Voltage VG1
DC Gate Supply Voltage VG2
RF In and Out
Pad
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 18. Die Layout
Pad No.
1
2
3
4
5
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Visit www.macom.com for additional data sheets and product information.
Size (μm)
100 x 200
200 x 150
500 x 200
150 x 150
150 x 125
MAAP-000077-PED000
Size (mils)
20 x 8
4 x 8
8 x 6
6 x 6
6 x 5
Preliminary Datasheet
Rev —