maam37000 Tyco Electronics, maam37000 Datasheet - Page 3

• Manufacturer Part Number: maam37000
• Description: Low Noise Gaas Mmic Amplifier 3.5-7ghz
• Manufacturer: Tyco Electronics

3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Low Noise GaAs MMIC Amplifier
3.5 - 7.0 GHz
Handling Procedures
Permanent damage to the MAAM37000 may occur if the
following precautions are not adhered to:
A.
B.
C. Transients - Avoid instrument and power supply
D. General Handling - DO NOT touch the surface of the
Mounting
The MAAM37000 is back-metallized with Pd/Ni/Au
(100/1, 000/30,000Å) metallization.
mounted using Au/Sn eutectic preforms or a thermally
and electrically conductive epoxy.
surface should be clean and flat.
Eutectic Die Attach:
A.
B.
Epoxy Die Attach:
A.
B.
C. Cure
Bonding
A.
B.
C. Bonding pads are 4.0 x 4.0 mils minimum.
Cleanliness - The MAAM37000 should be handled in
a clean environment.
assembly after the MAAM37000 is installed.
Static Sensitivity - All die handling equipment and
personnel should comply with DOD-STD-1686
Class I.
transients
MAAM37000. Use shielded signal and bias cables
to minimize inductive pick-up.
die. It is recommended that the MAAM37000 die be
handled along the long side with a sharp pair of
tweezers.
An 80/20 Au/Sn preform is recommended with a
work surface temperature of approximately 255°C
and a tool temperature of 265°C. When hot 95/5
nitrogen/hydrogen gas is applied, solder temperature
should be approximately 290°C.
DO NOT expose the MAAM37000 to a temperature
greater than 320°C for more than 20 seconds. No
more than 3 seconds of scrubbing should be
required for attachment.
Electrically conductive epoxy is required.
Apply a minimum amount of epoxy and place the
MAAM37000 into position. A thin epoxy fillet should
be visible around the perimeter of the die.
schedule.
Ball or wedge bond with 1.0 mil diameter gold wire of
3.0 mil x 0.5 mil ribbon. Thermosonic bonding with a
nominal stage temperature of
bonding force of 40 to 50 grams or wedge bonding
force of 18 to 22 grams is recommended. Ultrasonic
energy and time should be adjusted to the minimum
levels necessary to achieve reliable bonds.
Bonds should be started on the die and terminated
on the package.
epoxy per
while
bias
manufacturer’s
DO NOT attempt to clean
is
connected
150°C and a ball
The attachment
It can be die-
recommended
to
the
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• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.
Typical Bias Configuration
3. Nominal bias is obtained with on-chip resistors by grounding
4. Ground pads S1b and S2c for lower second state current.
5. Optional biasing can be obtained with off-chip resistors bonded
Outline Drawing
pads S1b and S2b.
from pads S1a and S2a to ground. Adjusting the bias can
customize the performance to suit special requirements.
3,4,5
MAAM37000
V5