maam26100 Tyco Electronics, maam26100 Datasheet - Page 3

• Manufacturer Part Number: maam26100
• Description: Power Gaas Mmic Amplifier 2-6.5ghz
• Manufacturer: Tyco Electronics

3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
GaAs MMIC Power Amplifier
2.0 - 6.5 GHz
Mounting
The MAAM26100 is back-metallized with Pd/Ni/Au
(100/1,000/30,000Å) metallization.
that the die be mounted with Au/Sn eutectic preforms.
The attachment surface should be clean and flat.
A.
B.
Bonding
A.
B.
C. Bonding pads are 4.0 x 4.0 mils minimum.
Handling Procedures
Permanent damage to the MAAM26100 may occur if the
following precautions are not adhered to:
A.
B.
C. Transients - Avoid instrument and power supply
D. General Handling - DO NOT touch the surface of
An 80/20 preform is recommended with a work
surface temperature of approximately 255°C and a
tool temperature of 265°C. When hot 90/5 nitrogen/
hydrogen gas is applied, solder temperature should
be approximately 290°C.
DO NOT expose the MAAM26100 to a temperature
greater than 320°C for more than 20 seconds. No
more than 3 seconds of scrubbing should be
required for attachment.
Ball or wedge bond with 1.0 mil diameter gold wire
of 3.0 mil x 0.5 mil ribbon. Thermosonic bonding
with a nominal stage temperature of 150°C and a
ball bonding force of 40 to 50 grams or wedge bond-
ing force of 18 to 22 grams is recommended. Ultra-
sonic energy and time should be adjusted to the
minimum levels necessary to achieve reliable bonds.
Bonds should be started on the die and terminated
on the package.
Cleanliness - The MAAM26100 should be handled
in a clean environment. DO NOT attempt to clean
assembly after the MAAM26100 is installed.
Static Sensitivity - All die handling equipment and
personnel should comply with DOD-STD-1686
Class I.
transients
MAAM26100. Use shielded signal and bias cables
to minimize inductive pick-up.
the die. It is recommended that the MAAM26100
die be handled along the long side with a sharp pair
of tweezers.
while
bias
is
connected
It is recommended
to
the
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5. Nominal bias is obtained by first connecting -1.3 volts to pads
6. The recommended V
Typical Bias Configuration
Bonding Table
7. Optional on-chip resistor networks are used by connecting a
V
V
G1
D2
nominal -5 volts to the pad V
bonding table.
Each gel pack is labeled with a CD # which corresponds to a
Bin # in the bonding table. For example, CD1 on the gel
pack corresponds to Bin 1, which means that pad E1 must
be connected to pad V
pad V
and V
(note sequence).
Bin #
G2
.
G2
1
2
3
4
followed by connecting +8 volts to pads V
RF IN
7
DD
range is +6 to +9 volts.
(V
(V
G1
D1
G1
V
V
, V
DD
, V
GG
and pad E2 must be connected to
D2
G2
)
)
GG
then connecting pads per the
D1 to V
C1 to V
E1 to V
B1 to V
1000 pF minimum
Bond Pads
5,6
G1
G1
G1
G1
RF OUT
, E2 to V
, D2 to V
, C2 to V
, B2 to V
MAAM26100
G2
G2
G2
G2
D1
and
V4