sky65124 Skyworks Solutions, Inc., sky65124 Datasheet - Page 7

• Manufacturer Part Number: sky65124
• Description: Sky65124 1930?1990 Mhz High Linearity 2 W Power Amplifier
• Manufacturer: Skyworks Solutions, Inc.

Pin Assignments
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer’s printed circuit board ground plane.
Evaluation Board Description
The Skyworks SKY65124 Evaluation Board is used to test the
performance of the SKY65124 power amplifier module. The
following design considerations are general in nature and must
be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65124 power amplifier module has
NOTE: Junction temperature (T
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as much
heat as possible from the amplifiers. As such, design the con-
nection to the ground pad to dissipate the maximum wattage
produced to the circuit. Multiple vias to the grounding layer are
required.
pin
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
poor connection to the slug and ground. This reduces the
lifetime of the device.
pin name
RF_OUT
V
RF_IN
V
V
C_BIAS
GND
GND
GND
GND
GND
V
V
GND
GND
GND
N/C
N/C
N/C
N/C
N/C
REF1
REF2
CC2
CC1
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [e-mail] • www.skyworksinc.com
200996 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • April 6, 2009
Low inductance ground connection
Low inductance ground connection
Low inductance ground connection
Bias voltage
No connect
Bias reference voltage 1
Bias reference voltage 2
Low inductance ground connection
RF output
Low inductance ground connection
Stage 2 collector voltage
No connect
Stage 1 collector voltage
No connect
No connect
RF input
Low inductance ground connection
No connect
Low inductance ground connection
Low inductance ground connection
J
) of the device increases with a
description
Evaluation Board
Evaluation Board Test Procedure
Step 1. Connect RF test equipment to amplifier input/output
Step 2. Connect DC ground.
Step 3. Connect all V
Step 4. Apply RF signal data -10 dBm level and observe that the
NOTE: It is important that the V
Recommended Solder Reflow Profiles
Refer to the
Application Note.
Tape and Reel Information
Refer to the
Tape and Reel Package Orientation”
GND
GND
5 V
5 V
5 V
adjusted such that 5 V is measured at the board. The
high collector currents will drop the collector voltage
significantly if long leads are used. Adjust the bias
voltage to compensate.
SMA connectors.
Verify the I
output level is approximately 14 dBm or the gain of the
device is approximately 24 dB.
“Discrete Devices and IC Switch/Attenuators
“Recommended Solder Reflow Profile”
J3
SKYWORKS 2006
VC_BIAS
VREF2
S/N
VREF1
GND
GND
CCQ
CC
current is approximately 550 mA.
, V
C2
C13
REG
preliminary Data Sheet • SKy65124
C2
C13
C3
C3
C1
R1
RFIN
R1
J2
J2
U1
and V
.
R2
R2
CC1
U1
and V
C_BIAS
C10
Application Note.
C7
RF_In
RF_Out
J1
J1
R3
R3
C9
C11
TW16-D190-
RF OUT
R4
R4
C6
C4
CC2
R5
C5
lines to 5 V supply.
C8
C12
C8
voltage source be
C12
VCC_DET
VCC2
VCC1
VDET
GND
J4
GND
N/C
N/C
5 V
5 V
7