sky65080-70lf Skyworks Solutions, Inc., sky65080-70lf Datasheet - Page 6
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sky65080-70lf
Manufacturer Part Number
sky65080-70lf
Description
Sky65080-70lf 1500-2500 Mhz Low Noise Power Amplifier Driver
Manufacturer
Skyworks Solutions, Inc.
Datasheet
1.SKY65080-70LF.pdf
(11 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SKY65080-70LF
Manufacturer:
SKYWORKS/思佳讯
Quantity:
20 000
DATA SHEET • SKY65080-70LF PA DRIVER
Evaluation Board Description
The Skyworks SKY65080-70LF Evaluation Board is used to test
the performance of the SKY65080-70LF PA driver. An assembly
drawing for the Evaluation Board is shown in Figure 11 and the
layer detail is provided in Figure 12.
Capacitors C7, C8, and C9 provide DC bias decoupling for VCC.
Pins 1 and 3 are the RF input and output signals, respectively.
External DC blocking is required on the input and output, but can
be implemented as part of the RF matching circuit. Pin 2 and the
package backside metal, pin 4, are ground pins that provide the
DC and RF ground, respectively.
6
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
March 19, 2010 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201042E
0.12
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
46
45
44
43
42
41
40
–10
1500
Figure 9. Operating Current vs Output Power Over Frequency
–5
Figure 10. Power-Added Efficiency vs Frequency
1600
1700 MHz
1850 MHz
1950 MHz
0
1700
Frequency (MHz)
Output Power (dBm)
+5
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65080-70LF power amplifier has
+10
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since the
circuit board acts as the heat sink, it must shunt as much
heat as possible from the amplifier. As such, design the
connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required.
1800
+15
1900
+20
2000
+25