s71ws-j Meet Spansion Inc., s71ws-j Datasheet - Page 19

• Manufacturer Part Number: s71ws-j
• Description: Stacked Multi-chip Product Mcp
• Manufacturer: Meet Spansion Inc.

August 19, 2005 S71WS-J_04_A2
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
A1
A2
D1
E1
Øb
eE
eD
A
D
E
n
A A2
CORNER
TSC080 - Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package
0.15
(2X)
PIN A1
0.17
0.81
0.35
MIN
A1
---
C
80X
9.00 mm x 7.00 mm
PACKAGE
9.00 BSC.
7.00 BSC.
7.20 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
0.15 M C
0.08 M C
0.80 BSC
TSC 080
INDEX MARK
6
NOM
0.40
N/A
10
80
---
---
---
b
8
9
A B
MAX
1.20
0.97
0.45
SIDE VIEW
TOP VIEW
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
P r e l i m i n a r y
NOTE
S71WS-J Based MCPs
C
A
0.15
(2X)
E
B
C
0.20
0.08
eE
eD
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
K
J
SD
H
BOTTOM VIEW
7
G
F
D1
E
D
C
B
A
SE
CORNER
PIN A1
3496 \ 16-038.22 \ 5.20.05
7
E1
17