le79r79 Zarlink Semiconductor, le79r79 Datasheet - Page 7

• Manufacturer Part Number: le79r79
• Description: Ringing Subscriber Line Interface Circuit
• Manufacturer: Zarlink Semiconductor

ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Stresses greater than those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or
above these limits is not implied. Exposure to absolute maximum ratings for extended periods can affect device reliability.
Note:
1.
2.
Package Assembly
Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
Thermal limiting circuitry on the chip will shut down the circuit at a junction temperature of about 165ºC. Continuous operation above 145ºC
junction temperature may degrade device reliability.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance
requires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through
multiple vias to a large internal copper plane.
Storage Temperature
V
V
V
V
BGND with respect to AGND/DGND:
A(TIP) or B(RING) to BGND:
Current from A(TIP) or B(RING)
RYOUT1, RYOUT2 current
RYOUT1, RYOUT2 voltage
RYOUT1, RYOUT2 transient
RYE voltage
C3–C1, D2–D1, E1, B2EN, and RINGIN:
Maximum power dissipation, continuous,
T
Thermal data:
ESD Immunity (Human Body Model)
A
CC
NEG
BAT2
BAT1
= 70º C, No heat sink (see note)
with respect to AGND/DGND
Continuous
10 ms
Continuous
10 ms (F = 0.1 Hz)
1 µs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
Input voltage
In 32-pin PLCC package
In 32-pin QFN package
In 32-pin PLCC package
In 32-pin QFN package
with respect to AGND/DGND
with respect to AGND/DGND:
Zarlink Semiconductor Inc.
7
–55 to +150º C
0.4 to +7 V
0.4 V to V
V
+0.4 to –80 V
+0.4 to –85 V
+3 to –3 V
V
V
V
V
±150 mA
75 mA
RYE to +7 V
RYE to +10 V
BGND to V
–0.4 V to V
1.67 W
3.00 W
θ
45° C/W
25° C/W
JESD22 Class 1C compliant
JA
BAT1
BAT1
BAT1
BAT1
BAT1
to GND
–5 to +1 V
–10 to +5 V
–15 to +8 V
–20 to +12 V
BAT2
BAT1
CC
+ 0.4 V