sigc06t60gs Infineon Technologies Corporation, sigc06t60gs Datasheet
sigc06t60gs
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sigc06t60gs Summary of contents
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... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC06T60GS Package Ordering Code Q67050- sawn on foil A4333-A101 mm 5 ...
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... Symbol Conditions =10A , SIGC06T60GS Value 600 -40 ... +175 Value min. typ. max. = 2mA 600 C =10A 1.5 2. 4.1 4.9 5 =0V ...
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... CHIP DRAWING: Edited by INFINEON Technologies CLS, L7521D, Edition 1, 09.06.2004 SIGC06T60GS ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies CLS, L7521D, Edition 1, 09.06.2004 SIGC06T60GS IKP10N60T ...