hmc607 Hittite Microwave Corporation, hmc607 Datasheet
hmc607
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hmc607 Summary of contents
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... Low Insertion Loss: 1.4 dB Typical @ 6.0 GHz Non-Refl ective Design Die Size: 2.05 x 1.04 x 0.1 mm General Description The HMC607 is a broadband high isolation non- refl ective GaAs MESFET SPDT MMIC chip. Covering GHz, the switch features >55 dB isolation at lower frequencies and > higher frequencies. The switch operates using complementary negative control voltage logic lines of -5/0V and requires no bias supply ...
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... FREQUENCY (GHz) 0.1 and 1 dB Input Compression Point FREQUENCY (GHz) +25 C + FREQUENCY (GHz) HMC607 RF1 RF2 0.1 dB Compression Point 1 dB Compression Point ...
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... Signal Path State A A RFC to RF1 RFC to RF2 Low High ON OFF High Low OFF ON Low High OFF OFF High Low 0/-5V Order On-line at www.hittite.com HMC607 Bias Condition 0 to -0. Max. - Typ Typ. ). ...
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... BACKSIDE METAL IS GROUND 6. BOND PAD METALIZATION: GOLD 7. NO CONNECTION REQUIRED FOR UNLABLED BOND PADS. 8. OVERALL DIE SIZE ±.002” Description See truth table and control voltage table. Alternate A & B control pads provided. Die bottom must be connected to RF ground. HMC607 4 Interface Schematic ...
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... Assembly Diagram 4 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 v01.0807 GaAs MMIC HIGH ISOLATION SPDT SWITCH GHz Order On-line at www.hittite.com HMC607 ...
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... All bonds should be as short as possible <0.31 mm (12 mils). For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC607 GaAs MMIC HIGH ISOLATION SPDT SWITCH GHz 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0 ...