cx3072 Chip Express Corporation, cx3072 Datasheet - Page 4

• Manufacturer Part Number: cx3072
• Description: 0.35um Structured Asic
• Manufacturer: Chip Express Corporation

RTL or FPGA Netlist Handoff
Disclaimer
© 2004–2007 ChipX, Incorporated
4 of 4
CX3000
0.35um Structured ASIC
ChipX, Inc.
development every time. The ChipX Design Toolkit checks design constraints, I/O rules, typical,
min and max case timing, glitches, contention and handoff database completeness. Our
standard ASIC and FPGA design flows are shown in Figure 1.
Figure 1 ChipX Structured ASIC and FPGA Design Flows
An increasing number of customers prefer to handoff their RTL designs early and let ChipX
perform the entire timing closure loop, including synthesis and final simulations. ChipX can also
convert obsolete design netlists, FPGA bitmaps, and even well-specified concept designs into
prototypes rapidly and reliably.
Packaging and Test
ChipX uses world-class external packaging and test facilities in the United States and Taiwan to
assemble and complete commercial, industrial or military testing and qualification of products.
The CX3000 product line is supported by a vast standard packaging library that includes the
most popular DIP, QFP, BGA, fine-pitch BGA, and PGA package sizes. For special applications,
multi-chip modules or hard-to-find hermetic or BGA package sizes, ChipX’s experienced custom
package design staff can create a package or pinout to your specifications.
This document is provided for general information only. Errors and omissions excluded (E&OE).
Email:
www.chipx.com
[e-mail]
Tel: [phone] Toll Free: 1-800-95-CHIPX Fax: [phone]
2323 Owen Street Santa Clara, California USA 95054
0283-3k-080-A
ChipX Data Sheet
April 9, 2007