ltm8032 Linear Technology Corporation, ltm8032 Datasheet - Page 14

• Manufacturer Part Number: ltm8032
• Description: Ultralow Noise Emc Compliant 36v, 2a Dc/dc ?module
• Manufacturer: Linear Technology Corporation

APPLICATIONS INFORMATION
LTM8032
The die temperature of the LTM8032 must be lower than
the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking
of the LTM8032. To estimate the junction temperature,
approximate the power dissipation within the LTM8032 by
applying the typical effi ciency stated in this data sheet to
the desired output power, or, if you have an actual module,
by taking a power measurement. Then calculate the tem-
perature rise of the LTM8032 junction above the surface
of the printed circuit board by multiplying the module’s
power dissipation by the thermal resistance. The actual
14
24V SUPPLY
IMPEDANCE
ENERGIZED
Figure 5. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures
Reliable Operation When the LTM8032 is Hot-Plugged to a Live Supply
LOW
+
+
+
SIMULATES HOT PLUG
CLOSING SWITCH
AI.EI.
0.1μF
22μF
35V
STRAY
INDUCTANCE
DUE TO 6 FEET
(2 METERS) OF
TWISTED PAIR
+
0.7Ω
I
IN
4.7μF
4.7μF
4.7μF
V
V
FIN
V
IN
IN
IN
LTM8032
LTM8032
LTM8032
(5a)
(5b)
(5c)
thermal resistance of the LTM8032 to the printed circuit
board depends upon the layout of the circuit board, but
the thermal resistance given in the Pin Confi guration,
as well as the internal temperature rise curves given in
the Typical Performance Characteristics section, can be
used a guide. Both the thermal resistance and internal
temperature rise curves are based upon a 36cm
FR4 PC board.
Finally, be aware that at high ambient temperatures the
internal Schottky diode will have signifi cant leakage current,
increasing the input quiescent current of the LTM8032.
20V/DIV
10A/DIV
20V/DIV
10A/DIV
20V/DIV
10A/DIV
V
V
V
I
I
I
IN
IN
IN
IN
IN
IN
DANGER
RINGING V
ABSOLUTE MAXIMUM RATING
20μs/DIV
20μs/DIV
20μs/DIV
IN
MAY EXCEED
8032 F05
2
4-layer
8032f