that1570 THAT Corporation, that1570 Datasheet - Page 11

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that1570

Manufacturer Part Number
that1570
Description
Low-noise, Differential Audio Preamplifier Ic
Manufacturer
THAT Corporation
Datasheet
THAT1570 Low-Noise
Differential Audio Preamplifier
Parameter
Package Style
Thermal Resistance
Environmental Regulation Compliance
Soldering Reflow Profile
Moisture Sensitivity Level
Figure 9. QFN-16 Surface Mount Package
C
J
ITEM
C
D
F
G
A
B
E
H
J
K
I
5
8
E
BOTTOM VIEW
4
MILLIMETERS
4.00 ± 0.10
4.00 ± 0.10
0.90 ± 0.05
0.30 ± 0.05
0.65 ± 0.05
0.40 ± 0.05
0.00 ~ 0.05
0.20 ± 0.05
2.60 ± 0.05
2.60 ± 0.05
C' 0.3 x 45°
9
K
I
A
12
1
Tel: +1 508 478 9200; Fax: +1 508 478 0990; Web: www.thatcorp.com
THAT Corporation; 45 Sumner Street; Milford, MA 01757-1656; USA
Exposed
Thermal Pad
13
16
H
D
F
Copyright © 2009, THAT Corporation; All rights reserved.
INCHES
0.157 ± 0.004
0.157 ± 0.004
0.035 ± 0.002
0.012 ± 0.002
0.026 ± 0.002
0.016 ± 0.002
0.000 ~ 0.020
0.008 ± 0.002
0.102 ± 0.002
0.102 ± 0.002
C‘ 0.012 x
Package and Soldering Information
Symbol
MSL Above-referenced JEDEC soldering profile
θ
45°
JA
G
Package Characteristics
B
QFN package soldered to board
Complies with January 27, 2003 RoHS requirements
See Fig. 9 for dimensions
Page 11 of 12
Conditions
2.10 mm
1.65 mm
1.05 mm
0.45 mm
(0.083”)
(0.065”)
(0.041”)
(0.018”)
16 pin QFN
Figure 10. QFN-16 Thermal Solder Pad
Package
JEDEC JESD22-A113-D (250 ºC)
0
Table 2. Ordering information
Min
16 Pin QFN
Hole: 0.254 mm (0.010”)
Pad: 0.30 mm (0.012”)
Typ
110
1
Document 600132 Rev 01
Order Number
Max
1570N16-U
Units
ºC/W

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