ssm3k105tu TOSHIBA Semiconductor CORPORATION, ssm3k105tu Datasheet

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ssm3k105tu

Manufacturer Part Number
ssm3k105tu
Description
Silicon N Channel Mos Type High Speed Switching Applications
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ssm3k105tu(TE85L)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
High Speed Switching Applications
Absolute Maximum Ratings
Electrical Characteristics
4V drive
Low on-resistance:
Drain-Source voltage
Gate-Source voltage
Drain current
Drain power dissipation
Channel temperature
Storage temperature range
Note:
Note 1: Mounted on ceramic board.
Note 2: Mounted on FR4 board.
Drain-Source breakdown voltage
Drain cut-off current
Gate leakage current
Gate threshold voltage
Forward transfer admittance
Drain-Source on-resistance
Input capacitance
Output capacitance
Reverse transfer capacitance
Switching time
Drain-Source forward voltage
Note3: Pulse test
Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure
rate, etc).
(25.4 mm × 25.4 mm × 0.8 mm, Cu Pad: 645 mm
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm
Characteristic
Characteristic
Turn-on time
Turn-off time
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type
DC
Pulse
R
R
R
on
on
on
= 480mΩ (max) (@V
= 200mΩ (max) (@V
= 110mΩ (max) (@V
(Ta = 25°C)
SSM3K105TU
V
P
P
R
(Ta = 25°C)
Symbol
(BR) DSS
Symbol
D (Note 1)
D (Note 2)
⏐Y
DS (ON)
V
I
I
C
V
C
C
DSS
GSS
V
V
t
t
T
DSF
T
I
oss
on
off
GSS
rss
iss
I
DP
th
fs
DS
stg
D
ch
I
V
V
V
V
I
I
I
V
V
V
V
V
I
D
D
D
D
D
GS
GS
GS
DS
GS
DS
DS
DS
DS
DS
DD
GS
= 1 mA, V
= 0.75 A, V
= 0.75 A, V
= 0.75 A, V
= −2.1A, V
= 30 V, V
= 5 V, I
= 5 V, I
= 15 V, V
= 15 V, V
= 15 V, V
= 15 V, I
−55~150
= ±16V, V
= 0~4 V, R
= 10V)
= 3.3V)
= 4V)
Rating
± 20
800
500
150
2.1
4.2
30
1
2
2
D
D
Test Conditions
GS
)
)
GS
D
GS
GS
GS
= 0.1 mA
= 0.75 A
GS
GS
GS
GS
DS
= 0.75 A,
G
= 0
= 0 V
= 10 V
= 4 V
= 3.3 V
= 0
= 0, f = 1 MHz
= 0, f = 1 MHz
= 0, f = 1 MHz
= 10 Ω
= 0
Unit
mW
°C
°C
V
V
A
(Note3)
(Note3)
(Note3)
(Note3)
(Note3)
Weight: 6.6 mg (typ.)
JEDEC
JEITA
TOSHIBA
UFM
Min
1.1
1.0
30
1: Gate
2: Source
3: Drain
−0.95
1
2
SSM3K105TU
Typ.
150
210
102
2.0
85
57
22
46
65
2.1±0.1
1.7±0.1
2-2U1A
2007-11-01
Max
110
200
480
1.8
±1
1.3
1
Unit: mm
3
Unit
μA
μA
pF
pF
pF
ns
V
V
S
V

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ssm3k105tu Summary of contents

Page 1

... 0. 0 Ω off = −2.1A DSF SSM3K105TU 2.1±0.1 1.7±0 Gate 2: Source 3: Drain UFM JEDEC ― JEITA ― TOSHIBA 2-2U1A Weight: 6.6 mg (typ.) Min Typ. Max ⎯ 30 ⎯ ⎯ ...

Page 2

... V IN OUT (c) V OUT V DD Equivalent Circuit (top view requires a higher voltage than V GS (on) < V < (off (on) 2 SSM3K105TU 4 V 90% 10 10% 90 (ON off =0.1mA for D ...

Page 3

... SSM3K105TU 2007-11-01 ...

Page 4

... Cu Pad :25.4mm×25.4mm 10 b:Mounted on FR4 board (25.4mm×25.4mm×1.6mm) Cu Pad :25.4mm×25.4mm c:Mounted on FR4 Board (25.4mm×25.4mm×1.6mm) Cu Pad :0.45mm×0.8mm×3 1 0.001 0.01 0.1 1 Pulse w idth tw (S) 4 SSM3K105TU 10 100 1000 2007-11-01 ...

Page 5

... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 SSM3K105TU 20070701-EN GENERAL 2007-11-01 ...

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