acpl-p454 Avago Technologies, acpl-p454 Datasheet - Page 4

no-image

acpl-p454

Manufacturer Part Number
acpl-p454
Description
High Cmr High Speed Optocoupler
Manufacturer
Avago Technologies
Datasheet
Recommended Solder Reflow Thermal Profile
TEMPERATURE
Note: Non-halide flux should be used
Recommended Pb-Free IR Profile
Note: Non-halide flux should be used
4
NOTES:
THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
ROOM
smax
smin
T
T
25
p
L
= 200 ˚C, T
150 - 200 ˚C
217 ˚C
300
200
100
0
0
smin
t 25 ˚C to PEAK
60 to 180 SEC.
3˚C/SEC. MAX.
PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
160˚C
150˚C
140˚C
PREHEAT
= 150 ˚C
RAMP-UP
t
s
260 +0/-5 ˚C
TIME
50
3˚C + 1˚C/-0.5˚C
t
150˚C, 90 + 30 SEC.
PREHEATING TIME
t p
L
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
2.5˚C ± 0.5˚C/SEC.
RAMP-DOWN
6 ˚C/SEC. MAX.
100
TIME (SECONDS)
TEMP.
PEAK
245˚C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200˚C
TIME
200
PEAK
TEMP.
240˚C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230˚C
250

Related parts for acpl-p454