op22002 Analog Devices, Inc., op22002 Datasheet - Page 4

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op22002

Manufacturer Part Number
op22002
Description
Dual Micropower Operational Amplifier
Manufacturer
Analog Devices, Inc.
Datasheet
OP220–SPECIFICATIONS
DIE CHARACTERISTICS
WAFER TEST LIMITS
Parameter
Input Offset Voltage
Input Offset Voltage Match
Input Offset Current
Input Bias Current
Input Voltage Range
Common-Mode
Power Supply
Large-Signal
Output Voltage Swing
Supply Current
NOTE
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Differential Input Voltage . . . . . . . . . . 30 V or Supply Voltage
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage
Output Short-Circuit Duration
Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C
Junction Temperature (T
Operating Temperature Range
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300∞C
NOTES
*Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packing is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on die lot qualification through sample lot assembly and testing.
Rejection Ratio
Rejection Ratio
Voltage Gain
(Both Amplifiers)
OP220A/OP220C . . . . . . . . . . . . . . . . . . –55∞C to +125∞C
OP220E/OP220F . . . . . . . . . . . . . . . . . . . . –25∞C to +85∞C
OP220G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40∞C to +85∞C
NOTE : ALL V+ PADS ARE INTERNALL CONNECTED
DIE SIZE 0.097 INCH
(2.464 mm
1.600 mm, 3.94 SQ. mm)
0.063 INCH, 6111 SQ. MILS
i
) . . . . . . . . . . . . . –65∞C to +150∞C
(@ V
S
Symbol
V
I
I
IVR
CMRR
PSRR
A
V
I
OS
B
SY
=
V
OS
VO
O
OS
2.5 V, to
1. INVERTING INPUT (A)
2. NONINVERTING INPUT (A)
3. BALANCE (A)
4. V–
5. BALANCE (B)
6. NONINVERTING INPUT (B)
7. INVERTING INPUT (B)
8. BALANCE (B)
9. V+
10. OUT (B)
11. V+
12. OUT (A)
13. V+
14. BALANCE (A)
15 V, T
Conditions
V
V
V
V– = 0 V, V+ = 5 V, 0 V £ V
–15 V £ V
V
V– = 0 V, V+ = 5 V to 30 V
R
V
V+ = 5 V, V– = 0 V, R
V
V
V
CM
CM
S
S
L
O
S
S
S
= ± 15 V
= ± 2.5 V to ± 15 V
= ± 15 V, R
= ± 2.5 V, No Load
= ± 15 V, No Load
= 25 kW, V
= ± 10 V
= 0
= 0
A
Indefinite
= 25 C, unless otherwise noted.)
CM
£ 13.5 V, V
S
L
= ± 15 V
= 25 kW
–4–
Package Type
8-Lead Hermetic DIP (Q)
8-Lead Plastic DIP (N)
8-Lead SOL (RN)
TO-99 (H)
*
T
V
(mV)
150
150
300
750
750
750
For military processed devices, please refer to the Mil Standard
Data Sheet
OP220AJ/883*.
*Not for new design. Obsolete April 2002.
in socket for CERDIP and PDIP packages;
printed circuit board for SO packages.
L
JA
A
OS
= 10 kW
is specified for worst-case mounting conditions, i.e.,
= 25∞C
S
MAX
= ± 15 V
CM
£ 3.5 V
CERDIP
OP220AZ*
OP220EZ*
OP220FZ*
OP220GZ* OP220GP*
ORDERING GUIDE
Package Options
Plastic
OP220CJ*
OP220GS
OP220N
Limit
200
300
2
25
–15/13.5
88
93
12.5
22.5
1000
0.7/4
± 14
125
190
148
103
158
150
JA
*
JA
is specified for device soldered to
TO-99
MIL
16
43
43
18
JA
JC
is specified for device
Operating
Temperature
Range
MIL
IND
IND
XIND
XIND
Unit
mV Max
mV Max
nA Max
nA Max
V Min
dB Min
mV/V Max
V/mV Min
V Min
mA Max
∞C/W
∞C/W
∞C/W
∞C/W
REV. A
Unit

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