ep7309 Cirrus Logic, Inc., ep7309 Datasheet - Page 29

• Manufacturer Part Number: ep7309
• Description: Ep7309 Data Sheet
• Manufacturer: Cirrus Logic, Inc.

204-Ball TFBGA Package Characteristics
204-Ball TFBGA Package Specifications
DS507F1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Y
W
C
1
A1 CORNER
2
3
4
5
TOP VIEW
6
SEATING PLANE
7
8
9 10 11
12 13
14 15
16
17
©
Figure 13. 204-Ball TFBGA Package
18
Copyright Cirrus Logic, Inc. 2005
19 20
(All Rights Reserved)
A
B
Ø0.25~0.35(204X)
Ø0.15 M C A
20
High-Performance, Low-Power System on Chip
19 18 17 16 15 14 13 12 11 10 9
B
Ball Pitch :
Ball Diam eter :
BOTTOM VIEW
13±0.05
12.35
0.65
0.3
8
Substrate Thickness :
Mold Thickness
7
A1 CORNER
6
5
0.65
:
4
3
2
EP7309
1
0.36
0.53
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
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