mc9s08fl16 Freescale Semiconductor, Inc, mc9s08fl16 Datasheet

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mc9s08fl16

Manufacturer Part Number
mc9s08fl16
Description
8-bit S08 Central Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Freescale Semiconductor
Data Sheet: Technical Data
MC9S08FL16 Series
Covers: MC9S08FL16 and
MC9S08FL8
Features:
8-Bit S08 Central Processor Unit (CPU)
On-Chip Memory
Power-Saving Modes
Clock Source Options
System Protection
© Freescale Semiconductor, Inc., 2009. All rights reserved.
This document contains information on a product under development. Freescale reserves the
right to change or discontinue this product without notice.
• Up to 20 MHz CPU at 4.5 V to 5.5 V across
• HC08 instruction set with added BGND instruction
• Support for up to 32 interrupt/reset sources
• Up to 16 KB flash read/program/erase over full
• Up to 1024-byte random-access memory (RAM)
• Security circuitry to prevent unauthorized access
• Two low power stop modes; reduced power wait
• Allows clocks to remain enabled to specific
• Oscillator (XOSC) — Loop-control Pierce
• Internal Clock Source (ICS) — Internal clock
• Watchdog computer operating properly (COP)
• Low-voltage detectionwith reset or interrupt;
• Illegal opcode detection with reset
temperature range of –40 °C to 85 °C
operating voltage and temperature
to RAM and flash contents
mode
peripherals in stop3 mode
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 1 MHz to 16 MHz
source module containing a
frequency-locked-loop (FLL) controlled by internal
or external reference; precision trimming of
internal reference allows 0.2% resolution and 2%
deviation over temperature and voltage; supports
bus frequencies up to 10 MHz
reset with option to run from dedicated 1 kHz
internal clock source or bus clock
selectable trip points
Development Support
Peripherals
Input/Output
Package Options
• Illegal address detection with reset
• Flash block protection
• Single-wire background debug interface
• Breakpoint capability to allow single breakpoint
• On-chip in-circuit emulator (ICE) debug module
• IPC — Interrupt priority controller to provide
• ADC — 12-channel, 8-bit resolution; 2.5 μs
• TPM — One 4-channel and one 2-channel
• MTIM16 — One 16-bit modulo timer with optional
• SCI — One serial communications interface
• 30 GPIOs including 1 output-only pin and 1
• 32-pin SDIP
• 32-pin LQFP
setting during in-circuit debugging (plus two more
breakpoints).
containing two comparators and nine trigger
modes.
hardware based nested interrupt mechanism
conversion time; automatic compare function;
1.7 mV/°C temperature sensor; internal bandgap
reference channel; operation in stop; optional
hardware trigger; fully functional from 4.5 V to
5.5 V
timer/pulse-width modulators (TPM) modules;
selectable input capture, output compare, or
buffered edge- or center-aligned PWM on each
channel
prescaler
module with optional 13-bit break; LIN extensions
input-only pin
32-Pin LQFP
873A-03
MC9S08FL16
Document Number: MC9S08FL16
Document Number: MC9S08FL16
Rev. 2, 7/2009
Rev. 2, 7/2009
32-Pin SDIP
1376-02

Related parts for mc9s08fl16

mc9s08fl16 Summary of contents

Page 1

... This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. © Freescale Semiconductor, Inc., 2009. All rights reserved. Document Number: MC9S08FL16 Document Number: MC9S08FL16 MC9S08FL16 32-Pin LQFP 873A-03 • Illegal address detection with reset • ...

Page 2

... Flash Specifications 5.12 EMC Performance . . . . . . . . . . . . . . . . . . . . . . . 27 5.12.1Radiated Emissions Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . 27 7 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.1 Mechanical Drawings Description of Changes Initial public release. Updated Section 5.12, “EMC Performance.” and corrected Corrected default trim value to 31.25 kHz. MC9S08FL16 Series Data Sheet, Rev. 2 Figure 1 and Table 1. Freescale Semiconductor ...

Page 3

... MCU Block Diagram The block diagram, Figure 1, shows the structure of MC9S08FL16 series MCU. HCS08 CORE BDC CPU HCS08 SYSTEM CONTROL RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT COP IRQ LVD ON-CHIP ICE AND DEBUG MODUE (DBG) USER FLASH MC9S08FL16 — 16,384 BYTES MC9S08FL8 — ...

Page 4

... System Clock Distribution 2 System Clock Distribution MC9S08FL16 series use ICS module as clock sources. The ICS module can use internal or external clock source as reference to provide MHz CPU clock. The output of ICS module includes, • OSCOUT — XOSC output provides external reference clock to ADC. ...

Page 5

... Pin Assignments This section shows the pin assignments for the MC9S08FL16 series devices. PTA5/IRQ/TCLK/RESET PTD2/TPM1CH2 PTA4/BKGD/MS PTB7/EXTAL PTB6/XTAL PTB5/TPM2CH1 PTD3/TPM1CH3 PTB4/TPM1CH0 PTC3/ADP11 PTC2/ADP10 Figure 3. MC9S08FL16 Series 32-Pin SDIP Package Freescale Semiconductor PTC5 1 PTC4 PTD0 6 PTD1 ...

Page 6

... Pin Assignments PTA4/BKGD/MS PTD0 PTD1 PTB7/EXTAL PTB6/XTAL PTB5/TPM1CH1 Figure 4. MC9S08FL16 Series 32-Pin LQFP Package Table 1. Pin Availability by Package Pin-Count Pin Number 32-SDIP 32-LQFP ...

Page 7

... I/O PTB0 I/O PTA7 I/O TPM2CH1 I/O PTA6 I/O TPM2CH0 I/O PTA3 I/O PTA2 I/O PTA1 I/O PTD5 I/O PTA0 I/O PTC7 I/O PTC6 I/O NOTE Table 1 illustrates the priority if multiple modules are MC9S08FL16 Series Data Sheet, Rev. 2 Pin Assignments --> Highest Alt 2 I/O Alt 3 I/O I ADP9 I ADP8 I ADP7 I ADP6 I TxD I/O ADP5 I RxD I ADP4 I ADP3 I ADP2 ...

Page 8

... Memory Map 4 Memory Map Figure 5 shows the memory map for the MC9S08FL16 series. On-chip memory in the MC9S08FL16 series of MCUs consists of RAM, flash program memory for nonvolatile data storage, plus I/O and control/status registers. The registers are divided into two groups: • Direct-page registers (0x0000 through 0x003F) • ...

Page 9

... Electrical Characteristics 5.1 Introduction This section contains electrical and timing specifications for the MC9S08FL16 series of microcontrollers available at the time of publication. 5.2 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To give the customer a better understanding, the following classification is used and the parameters are tagged accordingly in the tables where appropriate: Those parameters are guaranteed during production testing on each individual device ...

Page 10

... DD load will shunt current greater than maximum injection DD Table 4. Thermal Characteristics Symbol T A θ JA θ °C can be obtained from: J MC9S08FL16 Series Data Sheet, Rev. 2 Value Unit –0.3 to 5.8 V 120 mA –0 0 ±25 mA °C – ...

Page 11

... Using this value of K, the values iteratively for any value of T Table 5. ESD and Latch-Up Test Conditions Description Symbol R1 C — — — MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics Equation 3 by measuring and T can be obtained Value Unit Ω ...

Page 12

... In DD (per pin (per pin) R PU, — than PU, R — (Note ) MC9S08FL16 Series Data Sheet, Rev. 2 Min Max Unit ±2000 — V ±500 — V ±100 — Min. Typical Max. 4.5 — 5.5 V – 1.5 — — – 1.5 — ...

Page 13

... DD V — hys 7 V — BG range during instantaneous and operating maximum current DD > greater than I , the injection current may flow out MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics 1 Min. Typical Max. –0.2 — 0.2 > –5 — 5 — — ...

Page 14

... Typical I 50.000 45.000 40.000 35.000 30.000 25.000 20.000 15.000 10.000 5.000 0.000 0 Figure 6. Typical (High Drive 0.3 0.5 0 – 5.0 V) (High Drive MC9S08FL16 Series Data Sheet, Rev. 2 -40C 0C 25C 55C 85C 1.3 2 Freescale Semiconductor ...

Page 15

... Figure 7. Typical I Freescale Semiconductor vs (Low Drive 0.3 0.5 0 – 5.0 V) (Low Drive MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics -40C 0C 25C 55C 85C 1 ...

Page 16

... Electrical Characteristics Typical I 50.000 45.000 40.000 35.000 30.000 25.000 20.000 15.000 10.000 5.000 0.000 0 Figure 8. Typical (High Drive 0.3 0.5 0 5.0 V) (High Drive MC9S08FL16 Series Data Sheet, Rev. 2 -40C 0C 25C 55C 85C 1.3 2 Freescale Semiconductor ...

Page 17

... Figure 9. Typical I 5.7 Supply Current Characteristics This section includes information about power supply current in various operating modes. Freescale Semiconductor vs (Low Drive 0.3 0.5 0 5.0 V) (Low Drive MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics -40C 0C 25C 55C 85C 1 ...

Page 18

... DD 1 MHz 10 MHz MHz S2I — S3I — — — 5 — — 5 — — 5 MC9S08FL16 Series Data Sheet, Rev Max Unit Temp Typical –40 °C 5.66 25 °C 5.75 — 85 °C 5.80 mA 1.61 –40 °C 1.65 — 25 °C 1.78 85 °C –40 °C 2.79 25 °C 2.86 — ...

Page 19

... CSTL t CSTH t IRST f extal f int_t 6 f dco_t 4 Δf dco_t t Acquire MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics 1 Min Typical Max Unit 32 — 38.4 kHz 1 — 5 MHz 1 — 16 MHz 1 — 8 MHz 3 See Note 10 MΩ 1 MΩ ...

Page 20

... FLL circuitry via V a given interval. Figure 10. Typical Crystal or Resonator Circuit 20 and V and variation in crystal oscillator frequency increase the XOSC EXTAL R F Crystal or Resonator C 1 MC9S08FL16 Series Data Sheet, Rev Symbol Min Typical Max C — 0.02 0.2 Jitter percentage for Jitter XTAL R ...

Page 21

... Figure 11. Deviation of DCO Output from Trimmed Frequency (20 MHz, 5.0 V) 5.9 AC Characteristics This section describes timing characteristics for each peripheral system. Freescale Semiconductor 1.00% 0.50% 0.00% - -0.50% TBD -1.00% -1.50% -2.00% Temperature MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics 60 80 100 120 21 ...

Page 22

... Rise 5 t Rise = 5 °C unless otherwise stated. DD levels. Temperature range –40 ° °C. and 80 extrst Figure 12. Reset Timing MC9S08FL16 Series Data Sheet, Rev Min Typical Max dc — 10 700 — 1300 100 — — 34 × t — ...

Page 23

... Table 11. TPM Input Timing Function Symbol f TCLK t TCLK t clkh t clkl t ICPW t TCLK t clkh Figure 14. Timer External Clock t ICPW t ICPW Figure 15. Timer Input Capture Pulse MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics Min Max Unit Bus 4 — t cyc 1.5 — t cyc 1.5 — t cyc 1.5 — ...

Page 24

... MHz unless otherwise stated. Typical values are for reference ADCK SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Pad Z AS leakage due to input protection + V ADIN – INPUT PIN INPUT PIN INPUT PIN MC9S08FL16 Series Data Sheet, Rev Max Unit Comment — 5 100 mV 0 100 mV — REFH 4.5 5 ...

Page 25

... ADS — — m — V — TEMP25 E — TUE DNL — INL — E — — FS MC9S08FL16 Series Data Sheet, Rev. 2 Electrical Characteristics , REFL SSA 1 Typ Max Unit Comment μA 133 — μA 218 — μA 327 — 0.582 1 mA μ ...

Page 26

... FCLK t Fcyc 2 t prog 2 t Burst t Page t Mass RI DDBP RI DDPE 4 t D_ret . These values are measured at room temperatures DD MC9S08FL16 Series Data Sheet, Rev (continued) REFL SSA 1 Typ Max Unit ±0.5 2 — LSB Pad leakage ±0.1 ±1 2 LSB Min Typical Max — ...

Page 27

... Radiated emissions, V RE_TEM electric field 1 Data based on qualification test results. 6 Ordering Information This section contains ordering information for MC9S08FL16 series devices. See below for an example of the device numbering system. Device Number MC9S08FL16 MC9S08FL8 Freescale Semiconductor Table 15. Radiated Emissions, Electric Field Conditions ...

Page 28

... Package Information 1 See the reference manual, MC9S08FL16 Series Reference Manual, for a complete description of modules included on each device. 2 See Table 17 for package information. Example of the device numbering system: Status (MC = Fully Qualified) Memory (9 = Flash-based) Core Family 7 Package Information Pin Count Package Type 32 Low Quad Flat Package ...

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... Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. MC9S08FL16 Rev. 2 7/2009 ...

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