mc9s08lh36 Freescale Semiconductor, Inc, mc9s08lh36 Datasheet

mc9s08lh36

Manufacturer Part Number

mc9s08lh36

Description

Smart Metering And Medical Design Made Easy Covers Mc9s08lh64 And Mc9s08lh36

Manufacturer

Freescale Semiconductor, Inc

Datasheet

1.MC9S08LH36.pdf (44 pages)

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• 8-Bit HCS08 Central Processor Unit (CPU)

• On-Chip Memory

• Power-Saving Modes

• Clock Source Options

• System Protection

• Development Support

PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE

MC9S08LH64 Series

Covers: MC9S08LH64 and MC9S08LH36

Freescale Semiconductor

Data Sheet: Advanced Information

An Energy Efficient Solution by Freescale

– Up to 40 MHz CPU at 3.6 V to 2.1 V across temperature range

– Up to 20 MHz at 2.1 V to 1.8 V across temperature range of

– HC08 instruction set with added BGND instruction

– Support for up to 32 interrupt/reset sources

– Dual array flash read/program/erase over full operating

– Random-access memory (RAM)

– Security circuitry to prevent unauthorized access to RAM and

– Two low-power stop modes

– Reduced-power wait mode

– Low-power run and wait modes allow peripherals to run while

– Peripheral clock gating register can disable clocks to unused

– Very low-power external oscillator that can be used in stop2 or

– 6 μs typical wakeup time from stop3 mode

– Oscillator (XOSC) — Loop-control Pierce oscillator; crystal

– Internal Clock Source (ICS) — Internal clock source module

– Watchdog computer operating properly (COP) reset with

– Low-voltage warning with interrupt

– Low-voltage detection with reset or interrupt

– Illegal opcode detection with reset; illegal address detection

– Flash block protection

– Single-wire background debug interface

of –40 °C to 85 °C

–40 °C to 85 °C

voltage and temperature

flash contents

voltage regulator is in standby

modules, thereby reducing currents

stop3 modes to provide accurate clock source to time-of-day

(TOD) module

or ceramic resonator range of 31.25 kHz to 38.4 kHz or 1 MHz

to 16 MHz

containing a frequency-locked-loop (FLL) controlled by

internal or external reference; precision trimming of internal

reference allows 0.2% resolution and 2% deviation over

temperature and voltage; supporting bus frequencies from

1 MHz to 20 MHz

option to run from dedicated 1 kHz internal clock source or bus

clock

with reset

• Peripherals

• Input/Output

• Package Options

– Breakpoint capability to allow single breakpoint setting during

– On-chip in-circuit emulator (ICE) debug module containing

– LCD — Up to 8×36 or 4×40 LCD driver with internal charge

– ADC —16-bit resolution; with a dedicated differential ADC

– IIC — Inter-integrated circuit bus module to operate at up to

– ACMP — Analog comparator with selectable interrupt on

– SCIx — Two full-duplex non-return to zero (NRZ) modules

– SPI — Full-duplex or single-wire bidirectional;

– TPMx — Two 2-channel (TPM1 and TPM2); selectable input

– TOD — (Time-of-day) 8-bit, quarter second counter with

– VREFx — Trimmable via an 8-bit register in 0.5 mV steps;

– Dedicated accurate voltage reference output pin, 1.2 V output

– Up to 39 GPIOs, two output-only pins

– Hysteresis and configurable pullup device on all input pins;

– 14mm × 14mm 80-pin LQFP, 10 mm × 10 mm 64-pin LQFP

in-circuit debugging (plus two more breakpoints in on-chip

debug module)

three comparators and nine trigger modes

pump and option to provide an internally-regulated LCD

reference that can be trimmed for contrast control

input, and 8 single-ended ADC inputs; up to 2.5 μs conversion

time; hardware averaging; calibration registers, automatic

compare function; temperature sensor; operation in stop3;

fully functional from 3.6 V to 1.8 V

100 kbps with maximum bus loading; multi-master operation;

programmable slave address; interrupt-driven byte-by-byte

data transfer; broadcast mode; 10-bit addressing

rising, falling, or either edge of comparator output; compare

option to fixed internal reference voltage; outputs can be

optionally routed to TPM module; operation in stop3

(SCI1 and SCI2); LIN master extended break generation; LIN

slave extended break detection; wakeup on active edge

double-buffered transmit and receive; master or slave mode;

MSB-first or LSB-first shifting

capture, output compare, or buffered edge- or center-aligned

PWM on each channel

match register; external clock source for precise time base,

time-of-day, calendar, or task scheduling functions

automatically loaded with room temperature value upon reset;

can be enabled to operate in stop3 mode; trim register is not

available in stop modes

(VREFOx); trimmable with 0.5 mV resolution

configurable slew rate and drive strength on all output pins

Document Number: MC9S08LH64

64-LQFP

Case 840F

Rev. 4, 04/2010

80-LQFP

Case 917A

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mc9s08lh36 Summary of contents

Page 1

... Freescale Semiconductor Data Sheet: Advanced Information An Energy Efficient Solution by Freescale MC9S08LH64 Series Covers: MC9S08LH64 and MC9S08LH36 • 8-Bit HCS08 Central Processor Unit (CPU) – MHz CPU at 3 2.1 V across temperature range of –40 ° °C – MHz at 2 1.8 V across temperature range of – ...

Page 2

... Contains extensive product information including modes of operation, memory, resets and interrupts, register definition, port pins, CPU, and all module information. © Freescale Semiconductor, Inc., 2009-2010. All rights reserved. PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE 3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . .33 3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .33 3.13 VREF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .40 3 ...

Page 3

... MC9S08LH64 Series MCU. MC9S08LH64 Series MCU Data Sheet, Rev. 4 MC9S08LH36 80-pin 64-pin LQFP LQFP 36 KB (24,576 and 12,288 Arrays) 4000 yes 8-ch 8- yes yes 8 yes yes yes ...

Page 4

HCS08 CORE CPU INT BKGD BKP HCS08 SYSTEM CONTROL RESETS AND INTERRUPTS MODES OF OPERATION POWER MANAGEMENT COP IRQ LVD USER FLASH A (LH64 = 32,768 BYTES) (LH36 = 24,576 BYTES) USER FLASH B (LH64 = 32,768 BYTES) (LH36 = ...

Page 5

Pin Assignments This section shows the pin assignments for the This section shows the pin assignments for the MC9S08LH64 Series devices. PTE1/LCD14 PTE0/LCD13 PTD7/LCD7 PTD6/LCD6 PTD5/LCD5 PTD4/LCD4 PTD3/LCD3 PTD2/LCD2 PTD1/LCD1 PTD0/LCD0 V CAP1 V CAP2 V LL1 V LL2 ...

Page 6

PTE0/LCD13 1 LCD12 2 LCD11 3 LCD10 4 LCD9 5 LCD8 6 PTD7/LCD7 7 PTD6/LCD6 8 PTD5/LCD5 9 PTD4/LCD4 10 11 PTD3/LCD3 PTD2/LCD2 12 13 PTD1/LCD1 PTD0/LCD0 CAP1 V 16 CAP2 V 17 LL1 V 18 LL2 ...

Page 7

Table 2. Pin Availability by Package Pin-Count (continued Port Pin 9 5 PTD5 10 6 PTD4 11 7 PTD3 12 8 PTD2 13 9 PTD1 14 10 PTD0 CAP1 CAP2 17 13 ...

Page 8

Table 2. Pin Availability by Package Pin-Count (continued Port Pin 46 38 PTC7 47 39 PTA0 48 40 PTA1 49 41 PTA2 50 42 PTA3 51 43 PTA4 52 44 PTA5 LCD41 LCD40 55 ...

Page 9

Electrical Characteristics 3.1 Introduction This section contains electrical and timing specifications for the MC9S08LH64 Series of microcontrollers available at the time of publication. 3.2 Parameter Classification The electrical parameters shown in this supplement are guaranteed by various methods. To ...

Page 10

Thermal Characteristics Supply voltage Maximum current into V Digital input voltage Instantaneous maximum current Single pin limit (applies to all port pins) Storage temperature range 1 Input must be current limited to the value specified. To determine the value of ...

Page 11

Ambient temperature, ° θ = Package thermal resistance, junction-to-ambient, °C int I/O × Watts — chip internal power int Power ...

Page 12

DC Characteristics Table 6. ESD and Latch-up Test Conditions (continued) Minimum input voltage limit Latch-up Maximum input voltage limit Table 7. ESD and Latch-Up Protection Characteristics No. 1 Human body model (HBM) 2 Charge device model (CDM) 3 Latch-up current ...

Page 13

Num C Characteristic PTA[4:5], PTD[0:7], C low-drive strength Output low 6 P voltage PTA[4:5], PTD[0:7], high-drive strength C Output low 7 D Max total I current P Input high 8 all digital inputs voltage C P Input low 9 all ...

Page 14

DC Characteristics 1 Typical values are measured at 25°C. Characterized, not tested 2 All I/O pins except for LCD pins in Open Drain mode. 3 Total leakage current is the sum value for all GPIO pins. This leakage current is ...

Page 15

Figure 5. Typical Low-Side Driver (Sink) Characteristics (Non LCD Pins) Freescale Semiconductor PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev Characteristics Low Drive (PTxDSn = 0) — 15 ...

Page 16

DC Characteristics Figure 6. Typical Low-Side Driver (Sink) Characteristics(Non LCD Pins) 16 PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev. 4 High Drive (PTxDSn = 1) — Freescale Semiconductor ...

Page 17

Figure 7. Typical High-Side (Source) Characteristics (Non LCD Pins) Freescale Semiconductor PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev Characteristics Low Drive (PTxDSn = 0) — 17 ...

Page 18

DC Characteristics Figure 8. Typical High-Side (Source) Characteristics(Non LCD Pins) 18 PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev. 4 High Drive (PTxDSn = 1) — Freescale Semiconductor ...

Page 19

Figure 9. Typical Low-Side Driver (Sink) Characteristics (LCD/GPIO Pins) Freescale Semiconductor PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev Characteristics Low Drive (PTxDSn = 0) — 19 ...

Page 20

DC Characteristics Figure 10. Typical Low-Side Driver (Sink) Characteristics (LCD/GPIO Pins) 20 PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev. 4 High Drive (PTxDSn = 1) — Freescale Semiconductor ...

Page 21

Figure 11. Typical High-Side (Source) Characteristics (LCD/GPIO Pins) Freescale Semiconductor PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev Characteristics Low Drive (PTxDSn = 0) — 21 ...

Page 22

DC Characteristics Figure 12. Typical High-Side (Source) Characteristics (LCD/GPIO Pins) 22 PRELIMINARY-SUBJECT TO CHANGE WITHOUT NOTICE MC9S08LH64 Series MCU Data Sheet, Rev. 4 High Drive (PTxDSn = 1) — Freescale Semiconductor ...

Page 23

Supply Current Characteristics This section includes information about power supply current in various operating modes. Num C Parameter T Run supply current T 1 FEI mode, all modules Run supply current T 2 FEI mode, all ...

Page 24

Supply Current Characteristics Num C Parameter T LPO 1 T ERREFSTEN IREFSTEN 3 T TOD LVD ACMP ADC LCD 1 Not available in stop2 mode. ...

Page 25

External Oscillator (XOSCVLP) Characteristics Reference Figure 14 and Figure 15 Table 11. XOSCVLP and ICS Specifications (Temperature Range = –40 to 85°C Ambient) Num C Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1) Low range (RANGE = ...

Page 26

Internal Clock Source (ICS) Characteristics Figure 14. Typical Crystal or Resonator Circuit: High Range and Low Range/High Gain Figure 15. Typical Crystal or Resonator Circuit: Low Range/Low Power 3.9 Internal Clock Source (ICS) Characteristics Table 12. ICS Frequency Specifications (Temperature ...

Page 27

Table 12. ICS Frequency Specifications (Temperature Range = – °C Ambient) (continued) Num C Characteristic Total deviation of trimmed DCO output frequency over 9 C voltage and temperature Total deviation of trimmed DCO output frequency over fixed 10 ...

Page 28

AC Characteristics 3.10.1 Control Timing Num C Bus frequency (t = 1/f cyc ≤ 2. > 2. Internal low power oscillator period 3 D External reset pulse width 4 D Reset low ...

Page 29

IRQ/KBIPx IRQ/KBIPx 3.10.2 TPM Module Timing Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that can be used as the optional external source to the timer counter. These synchronizers operate from the current ...

Page 30

AC Characteristics 3.10.3 SPI Timing Table 15 and Figure 21 through No. C Function Operating frequency — D Master Slave SPSCK period D Master 1 Slave Enable lead time D Master 2 Slave Enable lag time D Master 3 Slave ...

Page 31

SS (OUTPUT) 2 SPSCK (CPOL = 0) (OUTPUT) SPSCK (CPOL = 1) (OUTPUT MISO 2 MS BIN (INPUT) 9 MOSI MSB OUT (OUTPUT) NOTES output mode (DDS7 = 1, SSOE = 1). 2. LSBF = ...

Page 32

AC Characteristics SS (INPUT) SPSCK (CPOL = 0) (INPUT) 2 SPSCK (CPOL = 1) (INPUT) 7 MISO SLAVE MSB OUT (OUTPUT) 5 MOSI MSB IN (INPUT) NOTE: 1. Not defined but normally MSB of character just received. SS (INPUT) 2 ...

Page 33

Analog Comparator (ACMP) Electricals Table 16. Analog Comparator Electrical Specifications C Characteristic D Supply voltage P Supply current (active) D Analog input voltage P Analog input offset voltage C Analog comparator hysteresis P Analog input leakage current C Analog ...

Page 34

ADC Characteristics Charact Num Conditions eristic 16 bit modes f > 8MHz ADCK 9 4MHz < f ADCK f < 4MHz ADCK 13/12 bit modes f > 8MHz ADCK 10 Analog 4MHz < f ADCK Source f < 4MHz ADCK ...

Page 35

– For Differential Mode, this figure applies to both inputs Figure 25. ADC Input Impedance Equivalency Diagram Table 18. 16-bit ADC Characteristics full operating range(V Characteristic Conditions Supply Current ADLPC = 1, ADHSC ...

Page 36

ADC Characteristics Table 18. 16-bit ADC Characteristics full operating range(V Characteristic Conditions Total 16-bit differential mode Unadjusted 16-bit single-ended mode Error 13-bit differential mode 12-bit single-ended mode 11-bit differential mode 10-bit single-ended mode 9-bit differential mode 8-bit single-ended mode Differential ...

Page 37

Table 18. 16-bit ADC Characteristics full operating range(V Characteristic Conditions Full-Scale 16-bit differential mode Error 16-bit single-ended mode 13-bit differential mode 12-bit single-ended mode 11-bit differential mode 10-bit single-ended mode 9-bit differential mode 8-bit single-ended mode Quantization 16 bit modes ...

Page 38

ADC Characteristics 1 All accuracy numbers assume the ADC is calibrated with V 2 Typical values assume V = 3.0V, Temp = 25°C, f DDA only and are not tested in production LSB = ( ...

Page 39

Table 19. 16-bit ADC Characteristics(V Characteristic Conditions Full-Scale 16-bit differential mode Error 16-bit single-ended mode 13-bit differential mode 12-bit single-ended mode 11-bit differential mode 10-bit single-ended mode 9-bit differential mode 8-bit single-ended mode Quantization 16 bit modes Error <13 bit ...

Page 40

VREF Specifications 1 All accuracy numbers assume the ADC is calibrated with V 2 Typical values assume V = 3.0V, Temp = 25°C, f DDA only and are not tested in production LSB = ( ...

Page 41

Table 20. VREF Electrical Specifications (continued) Num Characteristic 21 RESERVED (Mode[1:0] 11) 3.14 LCD Specifications # C Characteristic 1 D LCD Supply Voltage 2 D LCD Frame Frequency 3 D LCD Charge Pump Capacitance 4 D LCD Bypass Capacitance 5 ...

Page 42

... The radiated emissions from the microcontroller are measured in a TEM cell in two package orientations (North and East). 4 Ordering Information This appendix contains ordering information for the device numbering system. Device Number MC9S08LH64 MC9S08LH36 1 See Table 1 for a complete description of modules included on each device. 2 See Table 24 for package information ...

Page 43

Status (MC = Fully Qualified) Memory (9 = Flash-based) Core Family 4.2 Package Information Pin Count Package Type 80 Low Quad Flat Package 64 Low Quad Flat Package 4.3 Mechanical Drawings Table 24 provides the available package types and their ...

Page 44

... Freescale sales representative. For information on Freescale’s Environmental Products program http://www.freescale.com/epp. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009-2010. All rights reserved. ...

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