mc9s08ll16 Freescale Semiconductor, Inc, mc9s08ll16 Datasheet - Page 10

• Manufacturer Part Number: mc9s08ll16
• Description: 8-bit Hcs08 Central Processor Unit
• Manufacturer: Freescale Semiconductor, Inc

Electrical Characteristics
3.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
10
I/O
T
θ
P
P
P
JA
D
int
I/O
A
is neglected) is:
= Ambient temperature, °C
= P
Equation 3-1
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
SS
+ P
× V
or V
I/O
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
DD
Single-layer board
Four-layer board
DD
and
, Watts — chip internal power
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
I/O
64-pin LQFP
48-pin QFN
48-pin LQFP
64-pin LQFP
48-pin QFN
48-pin LQFP
into account in power calculations, determine the difference between actual pin
Equation 3-2
<< P
Rating
K = P
int
and can be neglected. An approximate relationship between P
Table 5. Thermal Characteristics
D
P
Subject to Change Without Notice
T
× (T
D
for K gives:
J
MC9S08LL16 Series, Rev. 2
= K ÷ (T
J
= T
) in °C can be obtained from:
A
+ 273°C) + θ
A
+ (P
Preliminary
J
D
+ 273°C)
× θ
Symbol
JA
θ
θ
T
T
JA
JA
JA
A
J
)
× (P
D
)
2
SS
–40 to 85
T
Value
L
or V
95
72
84
81
54
30
57
to T
H
DD
will be very small.
°C/W
°C/W
Unit
°C
°C
Freescale Semiconductor
D
Eqn. 3-1
Eqn. 3-2
Eqn. 3-3
and T
J