NUF4107FC
Four Channel EMI Pi−Filter
Array with Full USB Filter
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
Features
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•
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•
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Typical Applications
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Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. This does not include Pins B1, C1 and C2
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 3
MAXIMUM RATINGS
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ESD Discharge IEC61000−4−2 (Note 1)
Human Body Model
Machine Model
DC Power per Resistor
DC Power per Package
Junction Temperature
Operating Temperature Range
Storage Temperature Range
This device is a four−channel EMI filter array for data lines. Greater
EMI Filtering and ESD Protection for Data Lines
USB 1.1 Filtering Provided with Speed Detection
Integration of 27 Discretes Offers Cost and Space Savings
350 mm Solder Spheres
All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4)
Low Profile Flip−Chip Packaging
MSL 1
All Pins Exceed 2000 V Human Body Model (Note 1)
Pb−Free Package is Available*
EMI and USB Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Portables
Notebook Computers
MP3 Players
− Air Discharge, Contact Discharge
30 kV (Contact)
30 kV (Air)
Rating
(T
A
= 25°C)
Symbol
V
T
T
P
P
T
stg
PP
op
R
T
J
−55 to +150
−40 to +85
Value
100
600
150
0.4
30
16
1
Unit
mW
mW
kV
°C
°C
°C
†For information on tape and reel specifications,
NUF4107FCT1
NUF4107FCT1G
A1
A2
A3
A4
A5
A6
È
È
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
4107AYWW G
(Note: Microdot may be in either location)
Device
D
D
D
D
D
D
ORDERING INFORMATION
G
1
2
3
5
7
9
D
A1
CIRCUIT DESCRIPTION
11
MARKING DIAGRAM
http://onsemi.com
(Pb−Free)
Flip−Chip
Flip−Chip
Package
4107
A
Y
WW
G
B
B
B
B
C
C
C
C
C
C
2
3
4
5
7
9
5
1
2
3
Publication Order Number:
R
R
R
R
R
R
1
2
3
4
5
6
FLIP−CHIP−17
C
CASE 499AD
C
C
C
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
10
4
6
8
B
3000 Tape & Reel
3000 Tape & Reel
1
Shipping†
NUF4107FC/D
R
7
D
D
D
D
4
6
8
10
C1
C2
C3
C4
C5
C6