hcs157ms Intersil Corporation, hcs157ms Datasheet - Page 9

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hcs157ms

Manufacturer Part Number
hcs157ms
Description
Radiation Hardened Quad 2-input Multiplexers
Manufacturer
Intersil Corporation
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
84 x 84 mils
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCS157 is TA14371A.
5
1I1 (3)
2I0 (5)
2I1 (6)
2
1Y (4)
A/cm
Å
2
2.6k
Å
Å
1k
Å
HCS157MS
HCS157MS
181
Spec Number
(14) 4I0
(13) 4I1
(12) 4Y
(11) 3I0
(10) 3I1
518833

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