NBSG53AMN ON Semiconductor, NBSG53AMN Datasheet - Page 17
NBSG53AMN
Manufacturer Part Number
NBSG53AMN
Description
IC FLIP FLOP DIFF CLOCK 16QFN
Manufacturer
ON Semiconductor
Type
D-Type Busr
Datasheet
1.NBSG53AMNR2G.pdf
(18 pages)
Specifications of NBSG53AMN
Function
Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
2
Frequency - Clock
8GHz
Trigger Type
Positive, Negative
Voltage - Supply
2.375 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TQFN Exposed Pad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Delay Time - Propagation
-
Other names
NBSG53AMNOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4 X 4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
FCBGA−16
BA SUFFIX
M
M
K
ISSUE O
Z
Z
17
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
D
b
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
1.20 REF
MAX
0.35
0.50