tc9400 Microchip Technology Inc., tc9400 Datasheet - Page 19

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tc9400

Manufacturer Part Number
tc9400
Description
Voltage-to-frequency / Frequency-to-voltage Converters
Manufacturer
Microchip Technology Inc.
Datasheet

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© 2007 Microchip Technology Inc.
14-Lead Ceramic Dual In-Line (JD) – .300" Body [CERDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
NOTE 1
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A1
Number of Pins
Pitch
Top to Seating Plane
Standoff §
Ceramic Package Height
Shoulder to Shoulder Width
Ceramic Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
1
N
2
b
b1
D
e
Dimension Limits
Units
A1
A2
E1
E2
b1
N
A
E
D
e
L
c
b
A2
E1
L
MIN
.015
.140
.290
.230
.740
.125
.008
.045
.015
.320
TC9400/9401/9402
.100 BSC
INCHES
NOM
.288
.760
14
Microchip Technology Drawing C04-002B
E2
E
MAX
.200
.175
.325
.300
.780
.200
.015
.065
.023
.410
c
DS21483D-page 19

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