lm74a-5-mda National Semiconductor Corporation, lm74a-5-mda Datasheet - Page 2

• Manufacturer Part Number: lm74a-5-mda
• Description: Spi/microwire 12-bit Plus Sign Temperature Sensor Lm74 In Die Form
• Manufacturer: National Semiconductor Corporation

www.national.com
SI/O
SC
GND
NC
CS
V
Back
Connection Diagram
Bond Pad Mechanical Dimensions
Dimensions of bond pad coordinates are in millimeters.
Origin of coordinates: center of die.
X-Direction is in the longitudinal axis of the die.
Coordinates refer to center of Bond Pad.
Ordering Information
Pin Descriptions
+
Label
(Backside)
Pin#
1
2
3
4
5
6
Back
LM74A-5 MDA
LM74A-3 MDA
Pin #
Order Number
1
2
3
4
5
6
Slave Input/Output - Serial bus bi-directional data
line. Shmitt trigger input.
Slave Clock - Serial bus clock Shmitt trigger input
line.
Power Supply Ground
No Connection
Chip Select input.
Positive Supply Voltage Input
No Package, Die
No Package, Die
NS Package
Number
1.40mm x 1.57 mm (55 x 62 mils)
Function
Bond Pad Layout
X
-0.569 mm
-0.537 mm
-0.569 mm
n/a
+0.537 mm
+0.569 mm
4.5V to 5.5V
3.0V to 3.6V
Supply Voltage
TOP VIEW
LM74A
2
20017727
7k unit surftape tape-and-reel
7k unit surftape tape-and-reel
From and to Controller
From Controller
Ground
No Connection
From Controller
DC Voltage from 4.5V to 5.5V for the
LM74A-5 and 3.0V to 3.6V for the LM74A-3.
Bypass with a 0.1 µF ceramic capacitor.
Can go to GND connection
Transport Media
Typical Connection
Y
+0.585 mm
+0.314 mm
-0.554 mm
n/a
+0.277 mm
+0.569 mm