lp8765rlx National Semiconductor Corporation, lp8765rlx Datasheet - Page 12

• Manufacturer Part Number: lp8765rlx
• Description: High Performance Power Management Unit For Handset Applications
• Manufacturer: National Semiconductor Corporation

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V
V
I
R
Logic and Control Outputs
V
V
I
LEAK
OH
IL
IH
OL
OH
IN
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. .
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Maximum ambient
temperature (T
(P
MAX-OP
Note 6: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with T
are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 7: Guaranteed by design.
Note 8: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply
in cases it implies operation with an input voltage below the 2.5V minimum appearing under Operating Ratings. For example, this specification does not apply
for devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V.
Note 9: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design
Note 10: Full charging current is guaranteed for CHG_IN = 4.5 to 6.8V, but particularly at higher input voltages. Increased power dissipation may cause the
thermal regulation to limit the current to a safe level, resulting in longer charging time.
Note 11: Buck output voltage accuracy depends on the accuracy of the external feedback resistors. Resistor values should be chosen for the divider network to
ensure that at the desired output voltage the FB pin is at the specified value of VOUT. See Buck Converter Application Information.
Symbol
D-MAX
- (θ
), and the junction to ambient thermal resistance of the package in the application (θ
JA
x P
A-MAX
D-MAX
Input Low Level
Input High Level
Input Current
Input Resistance
Output Low Level
Output High Level
Open Drain Leakage
) is dependent on the maximum operating junction temperature (T
).
Parameter
SLEEP_N, PS_HOLD, RSTIN_N
SDA, SCL, SLEEP_N, PS_HOLD,
GPIO1-3 0V<V
RSTIN_N, PWR_ON
SDA, IRQ_N, RESTOUT_N, I
(Note
SDA I
IRQ_N, RSTOUT_N,
V
OH
=V
OH
7)
LDO5
= 2mA
= 3V
Conditions
IN
(Note
<V
12
BATT
7)
J-MAX-OP
JA
OL
). This relationship is given by the following equation: T
), the maximum power dissipation of the device in the application
= 2mA
Typ
500
0.7* VLD
VLDO5
0.75*
Min
O5
−5
J
= 25°C. All hot and cold limits
Limit
VLDO5
VLDO5
0.15*
Max
0.2*
+5
1
A-MAX
Units
µA
kΩ
µA
= T
V
V
V
V
J-