tle5012 Infineon Technologies Corporation, tle5012 Datasheet - Page 18

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tle5012

Manufacturer Part Number
tle5012
Description
Gmr-based Angular Sensor For Rotor Position Sensing
Manufacturer
Infineon Technologies Corporation
Datasheet

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Calculation of the Junction Temperature
The total power dissipation P
The power multiplied by the total thermal resistance
is the sum of the addition of the values of the two components
Example (assuming no load on V
For moulded sensors, the calculation with R
Target Data Sheet
T
V
R
I
DD
J
DD
thJA
T
T
=
=
=
=
=
T
=
150
R
12
A
5
R
thJA
V
+
mA
thJC
 
W
×
K
T
+
P
 
TOT
R
×
thCA
5
=
[ ]
V
R
×
thJA
TOT
. 0
×
of the chip increases its temperature above the ambient temperature.
012
out
(
):
V
[ ] [ ]
DD
A
×
+
thJC
I
0
DD
VA
is more adequate.
+
V
=
R
OUT
thJA
9
K
(Junction to Ambient) leads to the final junction temperature.
×
I
18
OUT
Junction to Case
(I
DD
, I
OUT
> 0, if direction is into IC)
and
Case to Ambient
.
V 0.41, 2009-02
Specification
TLE5012
R
thJA
(1)
(2)

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