tb6592fl TOSHIBA Semiconductor CORPORATION, tb6592fl Datasheet - Page 8

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tb6592fl

Manufacturer Part Number
tb6592fl
Description
Dual-bridge Driver Ic For Dc Motors
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
Requests Concerning Use of QON
Outline Drawing of Package
Caution
When using QON, take into account the following items.
(1)
(2)
Do not carry out soldering on the island sections in the four corners of the package (indicated by the
hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical
strength.
The projecting island sections on the package surfaces (indicated by the hatched sections in the
figures for the upper and lower surfaces above) must be electrically insulated from outside when used.
Note: Ensure that the island sections (indicated by the hatched sections in the figure for the lower surface,
When mounting or soldering, take care to ensure that neither static electricity nor electrical
When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the
overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.)
island section.
above left) do not come into contact with solder from through-holes on the board layout.
Upper surface
8
Lower surface
TB6592FL/FLG
2006-3-6

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