tb6552fn TOSHIBA Semiconductor CORPORATION, tb6552fn Datasheet
tb6552fn
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Page 1
... Toshiba Bi-CD Integrated Circuit Silicon Monolithic TB6552FN/FNG, TB6552FL/FLG DUAL-BRIDGE DRIVER IC FOR DC MOTORS The TB6552FN/FNG/FL/FLG is a dual-bridge driver IC for DC motors with output transistors MOS structure with low ON-resistance. Two input signals, IN1 and IN2, can chose one of four modes such as CW, CCW, short brake, and stop mode. A PWM drive system supports high heat efficiency driving ...
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... PWM control signal input pin 3 (Ch Control signal input 2 (Ch Control signal input 1 (Ch Small-signal power supply pin 2 TB6552FN/FNG/FL/FLG BO2 VM PGND AO2 Remarks GND for small-signal power supply (V CC Input PWM signal Ch. A circuit is in standby (power save) state while this signal is Low ...
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... L H OFF (high impedance GND PWM ON → OFF t2 = 300 ns (typ GND TB6552FN/FNG/FL/FLG Output Mode Short brake CW/CCW Short brake CCW/CW Short brake Stop Standby PWM OFF GND PWM ...
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... Input pins Input pins AIN1, AIN2, APWM, ASTBY, BIN1, BIN2, BPWM and BSTBY have internal pull-down resistors that are connected to ground. t pLH t pHL 90％ 90％ 50％ 50％ 10％ Unit ns 4 TB6552FN/FNG/FL/FLG 10％ 2007-4-2 ...
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... OUT 0. (Note 1) − °C opr −55 to 150 T °C stg °C) Symbol Min Typ. Max V 2.7 3.0 5 2.5 5.0 13.5 ⎯ ⎯ Iout 0.8 ⎯ ⎯ fPWM 100 5 TB6552FN/FNG/FL/FLG Remarks IN1, 2, STBY and PWM pins Unit kHz 2007-4-2 ...
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... ( 0 ( PWM t w (PWM Not tested t pLH (PWM) t pHL (PWM) T (Not tested) SD ΔT (Not tested TB6552FN/FNG/FL/FLG = 25°C) CC Min Typ. Max ⎯ 0.9 1.2 ⎯ 0.9 1.2 ⎯ 0.9 1.2 ⎯ ⎯ 10 ⎯ ⎯ ⎯ 0.2 −0.2 ⎯ ...
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... Hi-side VM – Ron 3000 2500 2000 1500 Ta = 85°C 1000 500 (V) 150 180 1000 800 600 400 Ta = 25°C 200 Ta = −20° TB6552FN/FNG/FL/FLG Lo-side V – Ron 85° 25° −20° (V) 2007-4-2 ...
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... Note APWM AO1 AIN1 AIN2 AO2 ASTBY TB6552 BPWM BO1 BIN1 BIN2 BO2 BSTBY GND PGND Note and GND lines since the IC may be destroyed TB6552FN/FNG/FL/FLG VM Note 1 M Note 2 M Note 2 2007-4-2 ...
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... When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.) • When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the island section. TB6552FN/FNG/FL/FLG Lower surface 9 2007-4-2 ...
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... Package Dimensions Weight: 0.07 g (typ.) TB6552FN/FNG/FL/FLG 10 2007-4-2 ...
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... Package Dimensions Weight: 0.05 g (typ.) Do not carry out soldering at the four corners of the package. 11 TB6552FN/FNG/FL/FLG 2007-4-2 ...
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... Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. TB6552FN/FNG/FL/FLG 12 2007-4-2 ...
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... If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. TB6552FN/FNG/FL/FLG 13 ) ...
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... Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. TB6552FN/FNG/FL/FLG 021023_D 021023_B 060106_Q 14 070122EBA_R6 ...