bd6761fs ROHM Co. Ltd., bd6761fs Datasheet - Page 22

• Manufacturer Part Number: bd6761fs
• Description: Motor Driver Ic Series For Printers Three-phase Brushless Motor Pre-driver For Paper Feed Us
• Manufacturer: ROHM Co. Ltd.

●Operation Notes
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4.
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6.
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8.
9.
10. PWM drive
11. Testing on application boards
Absolute maximum ratings
Connecting the power supply connector backward
Power supply lines
GND voltage
Thermal design
Inter-pin shorts and mounting errors
Operation in a strong electromagnetic field
ASO
Thermal shutdown circuit
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated
values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines.
An external direction diode can be added.
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs,
connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, note
that capacitance characteristic values are reduced at low temperatures.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection
error or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only
to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to
use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.
Voltage between the output FET drain and source may exceed the absolute maximum ratings due to the fluctuation of VCC at the
time of PWM driving. If there is the threat of this problem, it is recommended to take physical countermeasures for safety such as
inserting the capacitor between the VCC pin of FET and the detection resistor pin.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.
Use similar precaution when transporting or storing the IC.
BA6680FS
BD6761FS
BD6762FV
TSD on temperature [°C] (Typ.)
175
175
175
22/24
Hysteresis temperature [°C] (Typ.)
25
35
23