hip6016cb Intersil Corporation, hip6016cb Datasheet - Page 13

• Manufacturer Part Number: hip6016cb
• Description: Advanced Pwm And Dual Linear Power Control
• Manufacturer: Intersil Corporation

placed very close to the upper MOSFET to suppress the
voltage induced in the parasitic circuit impedances.
For a through hole design, several electrolytic capacitors
(Panasonic HFQ series or Nichicon PL series or Sanyo MV-
GX or equivalent) may be needed. For surface mount designs,
solid tantalum capacitors can be used, but caution must be
exercised with regard to the capacitor surge current rating.
These capacitors must be capable of handling the surge-
current at power-up. The TPS series available from AVX, and
the 593D series from Sprague are both surge current tested.
MOSFET Selection/Considerations
The HIP6016 requires 3 N-Channel power MOSFETs. Two
MOSFETs are used in the synchronous-rectified buck
topology of the PWM converter. The linear controller drives a
MOSFET as a pass transistor. These should be selected
based upon r
management requirements.
PWM MOSFET Selection and Considerations
In high-current PWM applications, the MOSFET power
dissipation, package selection and heatsink are the dominant
design factors. The power dissipation includes two loss
components; conduction loss and switching loss. These
losses are distributed between the upper and lower
MOSFETs according to duty factor (see the equations below).
The conduction loss is the only component of power
dissipation for the lower MOSFET. Only the upper MOSFET
has switching losses, since the lower device turns on into near
zero voltage.
The equations below assume linear voltage-current
transitions and do not model power loss due to the reverse-
recovery of the lower MOSFETs’ body diode. The
gate-charge losses are proportional to the switching
frequency (F
contributing to the MOSFETs’ temperature rise. However,
large gate charge increases the switching interval, t
which increases the upper MOSFET switching losses.
Ensure that both MOSFETs are within their maximum
junction temperature at high ambient temperature by
calculating the temperature rise according to package
thermal resistance specifications. A separate heatsink may
be necessary depending upon MOSFET power, package
type, ambient temperature and air flow.
P UPPER
P LOWER
The r
if the type device is used for both. This is because the gate
drive applied to the upper MOSFET is different than the
lower MOSFET. Figure 14 shows the gate drive where the
upper gate-to-source voltage is approximately V
DS(ON)
=
=
I O
----------------------------------------------------------------- -
I O
---------------------------------------------------------------------------------------
S
DS(ON)
is different for the two previous equations even
) and are dissipated by the HIP6016, thus not
2
2
r DS ON
r DS ON
, gate supply requirements, and thermal
V IN
2-208
V IN
V OUT
V IN V OUT
–
+
I O V IN t SW F S
------------------------------------------------------- -
2
CC
less the
SW
HIP6016
input supply. For +5V main power and +12VDC for the bias,
the gate-to-source voltage of Q1 is 7V. The lower gate drive
voltage is +12VDC. A logic-level MOSFET is a good choice for
Q1 and a logic-level MOSFET can be used for Q2 if its
absolute gate-to-source voltage rating exceeds the maximum
voltage applied to V
Rectifier CR1 is a clamp that catches the negative inductor
voltage swing during the dead time between the turn off of
the lower MOSFET and the turn on of the upper MOSFET.
The diode must be a Schottky type to prevent the lossy
parasitic MOSFET body diode from conducting. It is
acceptable to omit the diode and let the body diode of the
lower MOSFET clamp the negative inductor swing, but
efficiency might drop one or two percent as a result. The
diode’s rated reverse breakdown voltage must be greater
than twice the maximum input voltage.
Linear Controller MOSFET Selection
The main criteria for selection of a MOSFET for the linear
regulator is package selection for efficient removal of heat.
The power dissipated in a linear regulator is:
P LINEAR
Select a package and heatsink that maintains the junction
temperature below the maximum rating while operating at
the highest expected ambient temperature.
HIP6016
+
-
=
FIGURE 14. OUTPUT GATE DRIVERS
I O
VCC
+12V
V IN V OUT
GND
CC
UGATE
PHASE
LGATE
PGND
–
.
Q1
Q2
+5V OR LESS
CR1
NOTE:
V
NOTE:
V
GS
GS
V
V
CC
CC
-5V