hip6004d Intersil Corporation, hip6004d Datasheet - Page 4
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hip6004d
Manufacturer Part Number
hip6004d
Description
Buck And Synchronous-rectifier Pwm Controller And Output Voltage Monitor Hip6004d
Manufacturer
Intersil Corporation
Datasheet
1.HIP6004D.pdf
(14 pages)
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Absolute Maximum Ratings
Supply Voltage, V
Boot Voltage, V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.3V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 2
Operating Conditions
Supply Voltage, V
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
VCC SUPPLY CURRENT
Nominal Supply
POWER-ON RESET
Rising V
Falling V
Rising V
OSCILLATOR
Free Running Frequency
Total Variation
Ramp Amplitude
REFERENCE AND DAC
DAC (VID0-VID4) Input Low Voltage
DAC (VID0-VID4) Input High Voltage
DACOUT Voltage Accuracy
ERROR AMPLIFIER
DC Gain
Gain-Bandwidth Product
Slew Rate
GATE DRIVERS
Upper Gate Source
Upper Gate Sink
Lower Gate Source
Lower Gate Sink
PROTECTION
Over-Voltage Trip (VSEN/DACOUT)
OCSET Current Source
OVP Sourcing Current
Soft Start Current
1. θ
2. θ
3. For θ
Tech Brief TB379.
JA
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
CC
OCSET
JC
CC
, the “case temp” location is the center of the exposed metal pad on the package underside. See Tech Brief TB379
Threshold
Threshold
BOOT
PARAMETER
Threshold
CC
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+15V
. . . . . . . . . . . . . . . . . . . . . . . . . . . +12V ±10%
- V
PHASE
. . . . . . . . . . . . . . . . . . . . . . . .+15V
4
Recommended Operating Conditions, Unless Otherwise Noted
SYMBOL
R
R
I
I
ΔV
I
GBWP
UGATE
OCSET
LGATE
UGATE
LGATE
I
OVP
I
I
SR
CC
SS
OSC
o
C to 70
CC
UGATE and LGATE Open
V
V
RT = OPEN
6kΩ < RT to GND < 200kΩ
RT = Open
COMP = 10pF
V
I
V
I
V
V
+0.3V
LGATE
LGATE
OCSET
OCSET
BOOT
CC
OCSET
SEN
HIP6004D
o
C
= 12V, V
= 5.5V, V
- V
= 0.3A
= 0.3A
= 4.5V
= 4.5V
= 4.5V
PHASE
TEST CONDITIONS
LGATE
DC
OVP
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
= 12V, V
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2, 3). . . . . . . . . .
(SOIC - Lead Tips Only)
= 0V
= 6V
UGATE
= 6V
MIN
-1.0
185
350
300
170
-15
8.2
2.0
60
-
-
-
-
-
-
-
-
-
-
-
-
TYP
1.26
200
500
450
115
200
1.9
5.5
3.5
θ
88
15
10
5
6
-
-
-
-
-
-
-
JA
(
65
33
o
C/W)
MAX
10.4
+1.0
215
+15
120
230
0.8
6.5
10
-
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
July 13, 2005
JC
UNITS
V
MHz
V/μs
kHz
FN4855.3
NA
mA
mA
mA
mA
(
dB
µA
µA
%
P-P
%
%
o
5
V
V
V
V
V
Ω
Ω
C/W)
o
o
o
C
C
C