el7560 Intersil Corporation, el7560 Datasheet - Page 7

• Manufacturer Part Number: el7560
• Description: Programmable Cpu Power Supply Unit
• Manufacturer: Intersil Corporation

EL7560 Functional Block Diagram
Thermal considerations and power dissipation:
To achieve the maximum 12.4A continuous output current,
the EL7560 is packaged in a 28 pin HSOP (Heat-Slug SO
Package). Within the package, the EL7560 die is attached to
one side of a copper slug. The other side of the slug is
coincident with the package top surface, and is therefore
exposed to the ambient environment. The copper slug
provides an exceptionally low thermal resistance (TJC) of
typically 7°C/W. To obtain low junction to ambient thermal
resistance (TJA), a heatsink is required to provide heat
transfer path from the die to the ambient. The EL7560 power
dissipation is a direct function of the “on” resistance of the
internal power FETs (Rds-on) and the output current. For the
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
C
OSC
, Pin 25
VID [0:3], Pin
15,16,17,18
C
V
SLOPE
DD
C
REF
, Pin 26
, Pin 27
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
OUTEN, Pin 14
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+
+
-
-
4V
UVLO
S
R
7
DAC
I
SLOPE
V
DD
To V
6
OUT
FB, Pin 28
V
R
DD
SS
C
SS
EL7560
+
+
+
-
-
-
+
-
PWRGD, Pin 12
maximum 12.4A output current and the worse case Rds-on
at 125°C (35m:), the power dissipation is Iout
To maintain 12.4A continuous output current operation at the
maximum 70°C ambient temperature, the die temperature
must be kept below the 135°C thermal shut down
temperature. This requires a TJA of 12°C/W. To help achieve
such a low TJA with practical size heatsink, airflow is also
required. Application note #13 shows the 11°C/W thermal
resistance can be achieved with the Wakefield heatsink
#8052-60 and minimum 200LFM airflow.
Over Temp Sensor
Zero Cross Detect
LEB T
C
p-
R
, Pin 1
R
S
DELAY
FF
Q
Q
S
V2X
C
p+
, Pin 2
+
-
V
SS,
Pin 4
OT, Pin 13
Pin 6,7,8,9,10
VSSP, Pin
19,20,21
2
*R = 5.38W.
C2V, Pin 3
VDD and VIN,
Pin 21,23,24
VHI, Pin 5
LX,