lm27-2plmda National Semiconductor Corporation, lm27-2plmda Datasheet - Page 2

• Manufacturer Part Number: lm27-2plmda
• Description: Accurate, 120 C-150 C Factory Preset Thermostat Lm27 Form
• Manufacturer: National Semiconductor Corporation

www.national.com
Pin#
1
2
3
4
5
6
BACK
Ordering Information
For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteristics
Section. Contact National Semiconductor for other set points and output options.
Connection Diagram
Bond Pad Mechanical Dimensions
Dimensions of bond pad coordinates are in micrometers.
Origin of coordinates: center of die.
X-Direction is in the longitudinal axis of the die.
Coordinates refer to center of Bond Pad.
Opening sizes for bond pads 1 through 6 are 85 µm × 85 µm.
LM27-2PL MDA
Order Number
NS Package Number
Die form, no package
X
–437 µm
–437 µm
–437 µm
+437 µm
+437 µm
+437 µm
Bond Pad Layout
1130µm x 902µm
Trip Point Setting
TOP VIEW
LM27A
145°C
2
20153002
Output Function
Open-Drain (OS)
Push-Pull (OS)
Y
+225 µm
0
–220 µm
–220 µm
+5 µm
+225 µm
400 units in waffle
Transport Media
trays