cp2400-c-gdi Silicon Laboratories, cp2400-c-gdi Datasheet - Page 13
cp2400-c-gdi
Manufacturer Part Number
cp2400-c-gdi
Description
Tested 128 Segment Lcd Driver Die In Wafer Form
Manufacturer
Silicon Laboratories
Datasheet
1.CP2400-C-GDI.pdf
(16 pages)
Wafer ID
Wafer Dimensions
Die Dimensions
Wafer Thickness
Wafer Identification
Scribe Line Width
Die Per Wafer*
Passivation
Wafer Packaging Detail
Bond Pad Dimensions
Maximum Processing Temperature
Electronic Die Map Format
Bond Pad Pitch Minimum
*Note: This is the Expected Known Good Die yielded per wafer and
represents the batch order quantity (one wafer).
Table 3.3. Wafer and Die Information
Rev. 1.0
Contact Sales for info
1.88 mm x 1.64 mm
60 µm x 60 µm
Wafer Crisper
12 mil ±1 mil
CP2401C
Standard
250 °C
80 µm
65 µm
Notch
8 in
.txt
CP2400-C-GDI
13