ncp1588mntzg ON Semiconductor, ncp1588mntzg Datasheet - Page 11

• Manufacturer Part Number: ncp1588mntzg
• Description: Low Voltage Synchronous Buck Controller
• Manufacturer: ON Semiconductor

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LITERATURE FULFILLMENT:
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2X
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
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10X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
A B
NOTE 3
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
NCP1588, NCP1589, NCP1588A
E2
A
C
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
Phone: [phone]
PACKAGE DIMENSIONS
SEATING
PLANE
L1
http://onsemi.com
MOLD CMPD
DFN10, 3x3, 0.5P
CASE 485C-01
Bottom View
(Optional)
DETAIL A
ISSUE A
A1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
11
10X
EDGE OF PACKAGE
(Optional)
Side View
DETAIL B
2.1746
É É É É
É É
0.3008
10X
SOLDERING FOOTPRINT*
EXPOSED Cu
2.6016
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
A1
A3
D2
E2
L1
A
b
D
E
e
K
L
DIMENSIONS: MILLIMETERS
MILLIMETERS
MIN
0.80
0.00
0.18
2.45
1.75
0.35
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
0.5000 PITCH
1.8508
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03
3.3048
NCP1588/D