at17lv010 ATMEL Corporation, at17lv010 Datasheet - Page 15

• Manufacturer Part Number: at17lv010
• Description: 4m-bit Fpga Configuration Eeprom 5v And 3.3v
• Manufacturer: ATMEL Corporation

21. Thermal Resistance Coefficients
Notes:
2321I–CNFG–2/08
Package Type
8CN
4
8P3
8S1
20J
20S2
44A
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
Leadless Array Package (LAP)
Plastic Dual Inline Package
(PDIP)
Plastic Gull Wing Small Outline
(SOIC)
Plastic Leaded Chip Carrier
(PLCC)
Plastic Gull Wing Small Outline
(SOIC)
Thin Plastic Quad Flat
Package (TQFP)
θ
θ
θ
θ
θ
θ
[° C/W]
[° C/W]
[° C/W]
[° C/W]
[° C/W]
[° C/W]
JC
JC
JC
JC
JC
JC
[° C/W]
[° C/W]
[° C/W]
[° C/W]
[° C/W]
[° C/W]
θ
θ
θ
θ
θ
θ
JA
JA
JA
JA
JA
JA
(2)
(2)
(2)
(2)
(2)
(2)
AT17LV128/
(1)
AT17LV256
AT17LV65/
AT17LV65/128/256/512/010/002/040
115.71
107
150
45
37
45
35
90
–
–
AT17LV512/
AT17LV010
135.71
107
45
37
35
90
–
–
–
–
AT17LV002
159.60
45
35
90
17
62
–
–
–
–
AT17LV040
17
62
–
–
–
–
–
–
–
–
–
–
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