w25x16bv Winbond Electronics Corp America, w25x16bv Datasheet - Page 43

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w25x16bv

Manufacturer Part Number
w25x16bv
Description
16m-bit Serial Flash Memory With 4kb Sectors And Dual Output Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
w25x16bvSFIG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Part Number:
w25x16bvSSIG
Manufacturer:
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8-Pad WSON 6x5mm Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
SOLDER PATTERN
package.
placement of exposed PCB vias under the pad.
SYMBOL
M
N
Q
R
P
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
MAX
- 43 -
MIN
INCHES
0.
0.
0.
0.
0.
Publication Release Date: March 16, 2009
TYP
13
16
23
01
02
38
92
60
96
55
.
MAX
Preliminary -- Revision A
W25X16BV

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